Package outline dimensions, Suggested pad layout, Dmp3056ldm – Diodes DMP3056LDM User Manual
Page 5

DMP3056LDM
Document number: DS31449 Rev. 11 - 2
5 of 6
December 2012
© Diodes Incorporated
DMP3056LDM
Fig. 12 Transient Thermal Response
t , PULSE DURATION TIME (s)
1
0.00001
0.001
0.01
0.1
1
10
100
1,000
0.0001
0.001
0.01
0.1
1
r(t),
T
R
AN
S
IEN
T
T
H
E
R
MA
L
R
ES
IS
T
AN
C
E
T - T = P * R
(t)
Duty Cycle, D = t /t
J
A
JA
1 2
θ
R
(t) = r(t) *
θJA
R
R
= 96°C/W
θ
θ
JA
JA
P(pk)
t
1
t
2
D = 0.7
D = 0.5
D = 0.3
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
D = 0.9
D = 0.1
Package Outline Dimensions
Suggested Pad Layout
SOT26
Dim
Min Max Typ
A
0.35 0.50 0.38
B
1.50 1.70 1.60
C
2.70 3.00 2.80
D
⎯
⎯ 0.95
H
2.90 3.10 3.00
J
0.013 0.10 0.05
K
1.00 1.30 1.10
L
0.35 0.55 0.40
M
0.10 0.20 0.15
α
0° 8°
⎯
All Dimensions in mm
Dimensions
Value (in mm)
Z
3.20
G
1.60
X
0.55
Y
0.80
C1
2.40
C2
0.95
A
M
J
L
D
B C
H
K
X
Z
Y
C1
C2
C2
G