Diodes DMP2225L - Manual (Page 2)

DMP2225L
Document number: DS31461 Rev. 5 - 2
2 of 6
www.diodes.com
January 2013
© Diodes Incorporated
DMP2225L
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
-20 V
Gate-Source Voltage V
GSS
±12 V
Continuous Drain Current (Note 5)
Stead
State
T
A
= +25°C
T
A
= +70°C
I
D
-2.6
-2
A
Pulsed Drain Current (Note 6) I
DM
8 A
Thermal Characteristics
Characteristic Symbol Value Units
Total Power Dissipation (Note 5) P
D
1.08 W
Thermal Resistance, Junction to Ambient @T
A
= +25°C (Note 5) R
θJA
115 °C/W
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BV
DSS
-20 — — V V
GS
= 0V, I
D
= -250µA
Zero Gate Voltage Drain Current I
DSS
— — -800 nA V
DS
= -20V, V
GS
= 0V
On-State Drain Current I
D(ON)
-6 — —
A
V
DS ≤ -5V, V
GS
= -4.5V
-3 — — V
DS ≤ -5V, V
GS
= -2.5V
Gate-Source Leakage I
GSS
— — ±80 nA V
GS
= ±12V, V
DS
= 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
V
GS(th)
-0.45 — -1.25 V V
DS
= V
GS
, I
D
= -250µA
Static Drain-Source On-Resistance R
DS (ON)
—
80
165
110
225
mΩ
V
GS
= -4.5V, I
D
= -2.6A
V
GS
= -2.5V, I
D
= -2.0A
Forward Transfer Admittance |Y
fs
| — 4 — S V
DS
= -5V, I
D
= -2.6A
Diode Forward Voltage (Note 6) V
SD
— — -1.26 V V
GS
= 0V, I
S
= -2.6A
DYNAMIC CHARACTERISTICS
Input Capacitance
C
iss
— 250 — pF
V
DS
= -10V, V
GS
= 0V
f = 1.0MHz
Output Capacitance C
oss
— 88 — pF
Reverse Transfer Capacitance C
rss
— 58 — pF
Gate Resistance R
g
— 12 16 Ω V
GS
= 0V, V
DS
= 0V, f = 1MHz
Total Gate Charge Q
g
— 4.3 5.3
nC
V
GS
= -4.5V, V
DS
= -10V,
I
D
= -2.7A
Gate-Source Charge Q
gs
— 0.9 —
Gate-Drain Charge Q
gd
— 2.1 —
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Repetitive rating, pulse width limited by junction temperature.
7. Short duration pulse test used to minimize self-heating effect.