Package outline dimensions, Suggested pad layout – Diodes DMP2008UFG User Manual
Page 5

POWERDI is a registered trademark of Diodes Incorporated
DMP2008UFG
Document number: DS35694 Rev. 13 - 2
5 of 6
June 2013
© Diodes Incorporated
DMP2008UFG
ADVAN
CE I
N
F
O
RM
ATI
O
N
ADVAN
CE I
N
F
O
RM
ATI
O
N
Package Outline Dimensions
Suggested Pad Layout
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIMES (sec)
Fig. 13 Transient Thermal Resistance
0.001
0.01
0.1
r(
t),
T
R
A
N
SI
EN
T
T
H
E
R
MA
L
R
ES
IS
TAN
C
E
1
R
(t) = r(t) * R
R
= 125°C/W
Duty Cycle, D = t1/ t2
JA
JA
JA
D = 0.7
D = 0.9
D = 0.5
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
Single Pulse
POWERDI3333-8
Dim
Min
Max Typ
D
3.25
3.35 3.30
E
3.25
3.35 3.30
D2
2.22
2.32 2.27
E2
1.56
1.66 1.61
A
0.75
0.85 0.80
A1
0
0.05 0.02
A3
0.203
b
0.27
0.37 0.32
b2
0.20
L
0.35
0.45 0.40
L1
0.39
e
0.65
Z
0.515
All Dimensions in mm
Dimensions
Value (in mm)
C
0.650
G
0.230
G1
0.420
Y
3.700
Y1
2.250
Y2
1.850
Y3
0.700
X
2.370
X2
0.420
A
A1
A3
D
D2
E
E2
b2
(4x)
L
(4x)
L1
(3x)
b (8x)
e
Z (4x)
Pin 1 ID
1
4
8
5
X
Y
Y1
Y3
Y2
X2
C
1
4
8
5
G
G1