Dmn30h4d0lfde new prod uc t, Package outline dimensions, Suggested pad layout – Diodes DMN30H4D0LFDE User Manual
Page 5
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DMN30H4D0LFDE
Document number: DS36380 Rev. 4 - 2
5 of 6
May 2014
© Diodes Incorporated
DMN30H4D0LFDE
NEW PROD
UC
T
Package Outline Dimensions
Suggested Pad Layout
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIME (sec)
Figure 12 Transient Thermal Resistance
0.001
0.01
0.1
1
r(t),
T
R
ANSI
E
N
T
T
H
E
R
MA
L
R
ESI
S
TAN
C
E
D = 0.5
D = 0.7
D = 0.9
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
R
(t) = r(t) * R
R
= 207°C/W
Duty Cycle, D = t1/ t2
θ
θ
θ
JA
JA
JA
U-DFN2020-6
Type E
Dim
Min
Max Typ
A
0.57
0.63 0.60
A1
0 0.05
0.03
A3
— — 0.15
b
0.25
0.35 0.30
b1
0.185 0.285 0.235
D
1.95
2.05 2.00
D2
0.85 1.05 0.95
E
1.95 2.05 2.00
E2
1.40 1.60 1.50
e
— — 0.65
L
0.25 0.35 0.30
L1
0.82 0.92 0.87
K1
— —
0.305
K2
— —
0.225
Z
— — 0.20
All Dimensions in mm
Dimensions
Value
(in mm)
C
0.650
X
0.400
X1
0.285
X2
1.050
Y
0.500
Y1
0.920
Y2
1.600
Y3
2.300
A1
Z(4X)
b1
L1
K1
K2
D
D2
E
e
b(6X)
L(2X)
E2
A
A3
X1
Y3
X (6x)
C
X2
Y1
Y2
Y (2x)