Dmn30h14dly advanced information, Package outline dimensions, Suggested pad layout – Diodes DMN30H14DLY User Manual
Page 5: Dmn30h14dly
DMN30H14DLY
Document number: DS36812 Rev. 2 - 2
5 of 6
March 2014
© Diodes Incorporated
DMN30H14DLY
ADVANCED INFORMATION
t1, PULSE DURATION TIME (sec)
Figure 13 Transient Thermal Resistance
r(t),
T
R
ANSI
EN
T
T
H
E
R
MA
L
R
ESI
S
TAN
C
E
R
(t) = r(t) * R
R
= 136°C/W
Duty Cycle, D = t1/ t2
θ
θ
θ
JA
JA
JA
D = 0.5
D = 0.7
D = 0.9
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
0.001
0.01
0.1
1
0.000001 0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
Package Outline Dimensions
Suggested Pad Layout
SOT89
Dim Min Max
A 1.40 1.60
B 0.44 0.62
B1 0.35 0.54
C 0.35 0.43
D 4.40 4.60
D1
1.52 1.83
E 2.29 2.60
e 1.50
Typ
e1 3.00
Typ
H 3.94 4.25
L 0.89 1.20
All Dimensions in mm
Dimensions Value (in mm)
X
0.900
X1
1.733
X2
0.416
Y
1.300
Y1
4.600
Y2
1.475
Y3
0.950
Y4
1.125
C
1.500
e
D
H
L
A
C
E
8° (4
X)
B1
B
D1
R0
.20
0
e1
Y1
X1
Y2
Y
C
X (3x)
Y3
Y4
X2 (2x)