Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMG9N65CT User Manual
Page 2: Dmg9n65ct

DMG9N65CT
Document number: DS35619 Rev. 6 - 2
2 of 6
February 2013
© Diodes Incorporated
DMG9N65CT
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Drain-Source Voltage
V
DSS
650 V
Gate-Source Voltage
V
GSS
±30 V
Continuous Drain Current (Note 5) V
GS
= 10V
Steady
State
T
C
= +25°C
T
C
= +70°C
I
D
9.0
7.0
A
Pulsed Drain Current (Note 6)
I
DM
30 A
Avalanche Current (Note 7) V
DD
= 100V, V
GS
= 10V, L = 60mH
I
AR
2.7 A
Repetitive Avalanche Energy (Note 7) V
DD
= 100V, V
GS
= 10V, L = 60mH
E
AR
260 mJ
Thermal Characteristics
Characteristic Symbol
Max
Unit
Power Dissipation (Note 5) T
C
= +25°C
T
C
= +70°C
P
D
165
100
W
Thermal Resistance, Junction to Case (Note 5)
R
θJC
0.7
°C/W
Operating and Storage Temperature Range
T
J
,
T
STG
-55 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BV
DSS
650 — — V V
GS
= 0V, I
D
= 250µA
Zero Gate Voltage Drain Current T
J
= +25°C
I
DSS
— — 1.0 µA
V
DS
= 650V, V
GS
= 0V
Gate-Source Leakage
I
GSS
— —
±100 nA
V
GS
= ±30V, V
DS
= 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
V
GS(th)
3 — 5 V
V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance
R
DS (ON)
—
0.7 1.3 Ω
V
GS
= 10V, I
D
= 4.5A
Forward Transfer Admittance
|Y
fs
|
—
8.5 — S
V
DS
= 40V, I
D
= 4.5A
Diode Forward Voltage
V
SD
—
0.7 1.0 V V
GS
= 0V, I
S
= 1A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
C
iss
—
2310
—
pF
V
DS
= 25V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
— 122 —
Reverse Transfer Capacitance
C
rss
— 2.2 —
Gate Resistance
R
g
— 2.2 — Ω
V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge V
GS
= 10V
Q
g
— 39 —
nC
V
GS
= 10V, V
DS
= 520V,
I
D
= 8A
Gate-Source Charge
Q
gs
— 8.5 —
Gate-Drain Charge
Q
gd
— 11.9 —
Turn-On Delay Time
t
D(on)
— 39 — ns
V
GS
= 10V, V
DS
= 325V,
R
G
= 25Ω, I
D
= 8A
Turn-On Rise Time
t
r
— 29 — ns
Turn-Off Delay Time
t
D(off)
— 122 — ns
Turn-Off Fall Time
t
f
— 28 — ns
Body Diode Reverse Recovery Time
t
rr
— 570 — ns
dI/dt = 100A/µs, V
DS
= 100V,
I
F
= 8A
Body Diode Reverse Recovery Charge
Q
rr
— 4.17 — µC
Notes:
5. Device mounted on an infinite heatsink
6. Repetitive rating, pulse width limited by junction temperature.
7. I
AR
and E
AR
rating are based on low frequency and duty cycles to keep T
J
= +25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.