Dmb54d0uv, Maximum ratings – mosfet, q1, Maximum ratings - pnp transistor, q2 – Diodes DMB54D0UV User Manual
Page 2: Thermal characteristics, total device, Electrical characteristics - mosfet

DMB54D0UV
Document number: DS31676 Rev. 5 - 2
2 of 7
March 2012
© Diodes Incorporated
DMB54D0UV
Maximum Ratings – MOSFET, Q1
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
50 V
Gate-Source Voltage
V
GSS
±12
V
Drain Current (Note 4)
Continuous
I
D
160 mA
Pulsed Drain Current (Note 4)
I
DM
560 mA
Maximum Ratings - PNP Transistor, Q2
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Unit
Collector-Base Voltage
V
CBO
-50 V
Collector-Emitter Voltage
V
CEO
-45 V
Emitter-Base Voltage
V
EBO
-5.0 V
Collector Current
I
C
-100 mA
Thermal Characteristics, Total Device
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Unit
Total Power Dissipation (Note 4)
P
D
250 mW
Thermal Resistance, Junction to Ambient (Note 4)
R
θJA
500
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-55 to +150
°C
Electrical Characteristics - MOSFET
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Min
Typ
Max
Unit
Test
Condition
OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage
BV
DSS
50
⎯
⎯
V
V
GS
= 0V, I
D
= 250
μA
Zero Gate Voltage Drain Current
I
DSS
⎯
⎯
10
μA
V
DS
= 50V, V
GS
= 0V
Gate-Body Leakage
I
GSS
⎯
⎯
1.0
5.0
μA
V
GS
=
±8V, V
DS
= 0V
V
GS
=
±12V, V
DS
= 0V
ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage
V
GS(th)
0.7 0.8 1.0 V
V
DS
= V
GS
, I
D
= 250
μA
Static Drain-Source On-Resistance
R
DS (ON)
⎯
3.1 4 Ω
V
GS
= 4V, I
D
= 100mA
⎯
4 5
V
GS
= 2.5V, I
D
= 80mA
Forward Transconductance
g
FS
180
⎯
⎯
mS
V
DS
= 10V, I
D
= 100mA,
f = 1.0KHz
DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance
C
iss
⎯
25
⎯
pF
V
DS
= 10V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
⎯
5
⎯
pF
Reverse Transfer Capacitance
C
rss
⎯
2.1
⎯
pF
Notes:
4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to product testing.