Marking information, Maximum ratings, Thermal characteristics – Diodes DMS3014SFG User Manual
Page 2

POWERDI is a registered trademark of Diodes Incorporated
DMS3014SFG
Document number: DS35594 Rev. 6 - 2
2 of 8
May 2012
© Diodes Incorporated
DMS3014SFG
ADVAN
CE I
N
F
O
RM
ATI
O
N
Marking Information
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
30 V
Gate-Source Voltage
V
GSS
±12 V
Continuous Drain Current (Note 6) V
GS
= 10V
Steady
State
T
A
= 25°C
T
A
= 70°C
I
D
9.5
7.6
A
t<10s
T
A
= 25°C
T
A
= 70°C
I
D
13.0
9.7
A
Continuous Drain Current (Note 6) V
GS
= 4.5V
Steady
State
T
A
= 25°C
T
A
= 70°C
I
D
9.0
7.4
A
t<10s
T
A
= 25°C
T
A
= 70°C
I
D
12.2
9.3
A
Pulsed Drain Current (10
μs pulse, duty cycle = 1%)
I
DM
80 A
Maximum Continuous Body Diode Forward Current (Note 6)
I
S
3.0 A
Avalanche Current (Note 7) L = 0.1mH
I
AR
30 A
Repetitive Avalanche Energy (Note 7) L = 0.1mH
E
AR
45 mJ
Thermal Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Units
Total Power Dissipation (Note 5)
P
D
1 W
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
R
θJA
131 °C/W
t<10s 72
°C/W
Total Power Dissipation (Note 6)
P
D
2.1 W
Thermal Resistance, Junction to Ambient (Note 6)
Steady state
R
θJA
63 °C/W
t<10s 35
°C/W
Thermal Resistance, Junction to Case (Note 6)
R
θJC
7.1 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. I
AR
and E
AR
rating are based on low frequency and duty cycles to keep T
J
= 25°C
S29
YY
W
W
S29 = Product Type Marking Code
YYWW = Date Code Marking
YY = Last digit of year (ex: 11 = 2011)
WW = Week code (01 ~ 53)