Dmn3032le new prod uc t, Package outline dimensions, Suggested pad layout – Diodes DMN3032LE User Manual
Page 5: Dmn3032le

DMN3032LE
Document number: DS36695 Rev. 2 - 2
5 of 6
May 2014
© Diodes Incorporated
DMN3032LE
NEW PROD
UC
T
Package Outline Dimensions
Suggested Pad Layout
0.001
0.01
0.1
0.0001
0.001
0.01
0.1
1
10
100
1000
1
t1, PULSE DURATION TIME (sec)
Figure 12 Transient Thermal Resistance
r(
t), T
R
A
N
SI
ENT T
H
E
R
MA
L
R
ES
IS
TA
N
C
E
R
(t) = r(t) * R
R
= 99°C/W
Duty Cycle, D = t1/ t2
θ
θ
θ
JA
JA
JA
D = 0.5
D = 0.7
D = 0.9
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
SOT223
Dim Min Max Typ
A 1.55
1.65
1.60
A1 0.010 0.15 0.05
b 0.60
0.80
0.70
b1 2.90 3.10 3.00
C 0.20
0.30
0.25
D 6.45
6.55
6.50
E 3.45
3.55
3.50
E1 6.90 7.10 7.00
e - -
4.60
e1 - - 2.30
L 0.85
1.05
0.95
Q 0.84
0.94
0.89
All Dimensions in mm
Dimensions Value (in mm)
X1
3.3
X2
1.2
Y1
1.6
Y2
1.6
C1
6.4
C2
2.3
X2
C1
C2
X1
Y2
Y1
A1
A
7°
7°
D
b
e
e1
b1
C
E1
L
0°-
10
°
Q
E
0.25
Seating
Plane
Gauge
Plane