Maximum ratings, Thermal characteristics – Diodes DMN3024SFG User Manual
Page 2
POWERDI is a registered trademark of Diodes Incorporated
DMN3024SFG
Document number: DS35439 Rev. 3 - 2
2 of 7
May 2012
© Diodes Incorporated
DMN3024SFG
ADVAN
CE I
N
F
O
RM
ATI
O
N
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
30 V
Gate-Source Voltage
V
GSS
±25 V
Continuous Drain Current (Note 6) V
GS
= 10V
Steady
State
T
A
= 25°C
T
A
= 70°C
I
D
7.5
6.0
A
t<10s
T
A
= 25°C
T
A
= 70°C
I
D
10.5
8.5
A
Continuous Drain Current (Note 6) V
GS
= 4.5V
Steady
State
T
A
= 25°C
T
A
= 70°C
I
D
6.3
5.0
A
t<10s
T
A
= 25°C
T
A
= 70°C
I
D
8.5
7.6
A
Pulsed Drain Current (10
μs pulse, duty cycle = 1%)
I
DM
60 A
Avalanche Current (Note 7)
I
AS
9 A
Repetitive Avalanche Energy (Note 7)
E
AS
12 mJ
Thermal Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Units
Total Power Dissipation (Note 5)
T
A
= 25°C
P
D
0.9
W
T
A
= 70°C
0.5
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
R
θJA
145
°C/W
t<10s 74
Total Power Dissipation (Note 6)
T
A
= 25°C
P
D
2.2
W
T
A
= 70°C
1.4
Thermal Resistance, Junction to Ambient (Note 6)
Steady state
R
θJA
58
°C/W
t<10s 31
Thermal Resistance, Junction to Case (Note 6)
R
θJC
11
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7 .UIS in production with L = 0.3mH, TJ = 25°C