Package outline dimensions, Suggested pad layout – Diodes DMN2501UFB4 User Manual
Page 5

DMN2501UFB4
Document number: DS35824 Rev. 3 - 2
5 of 6
August 2012
© Diodes Incorporated
DMN2501UFB4
ADVAN
CE I
N
F
O
RM
ATI
O
N
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1,000
t1, PULSE DURATION TIME (sec)
Fig. 13 Transient Thermal Resistance
R
(t) = r(t) * R
R
= 251°C/W
Duty Cycle, D = t1/ t2
θ
θ
θ
JA
JA
JA
0.001
0.01
0.1
1
r(
t),
T
R
A
N
SI
EN
T
T
H
E
R
MA
L
R
ES
IS
T
AN
C
E
D = 0.5
D = 0.7
D = 0.9
D = 0.3
D = 0.1
D = 0.05
D = 0.02
D = 0.01
D = 0.005
D = Single Pulse
Package Outline Dimensions
Suggested Pad Layout
X2-DFN1006-3
Dim
Min
Max Typ
A
⎯
0.40
⎯
A1
0
0.05 0.03
b1
0.10
0.20 0.15
b2
0.45
0.55 0.50
D
0.95
1.05 1.00
E
0.55
0.65 0.60
e
⎯
⎯
0.35
L1
0.20
0.30 0.25
L2
0.20
0.30 0.25
L3
⎯
⎯
0.40
All Dimensions in mm
Dimensions
Value (in mm)
Z
1.1
G1
0.3
G2
0.2
X
0.7
X1
0.25
Y
0.4
C
0.7
Y
C
G1
G2
X
X
1
Z
L2
A1
E
b2
L1
L3
D
e
b1
A