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Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMN2004VK User Manual

Page 2: Dmn2004vk

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DMN2004VK

Document number: DS30865 Rev. 5 - 2

2 of 6

www.diodes.com

March 2012

© Diodes Incorporated

DMN2004VK





Maximum Ratings

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Drain-Source Voltage

V

DSS

20 V

Gate-Source Voltage

V

GSS

±8

V

Drain Current (Note 4) Steady
State

T

A

= 25°C

T

A

= 85°C

I

D

540
390

mA

Pulsed Drain Current (10

μs pulse, duty cycle = 1%)

I

DM

1.5 A




Thermal Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Value

Units

Total Power Dissipation (Note 4)

P

D

250 mW

Thermal Resistance, Junction to Ambient

R

θJA

500 °C/W

Operating and Storage Temperature Range

T

J,

T

STG

-55 to +150

°C



Electrical Characteristics

@T

A

= 25°C unless otherwise specified

Characteristic Symbol

Min

Typ

Max

Unit

Test

Condition

OFF CHARACTERISTICS (Note 5)
Drain-Source Breakdown Voltage

BV

DSS

20

V

V

GS

= 0V, I

D

= 10

μA

Zero Gate Voltage Drain Current

I

DSS

1

μA

V

DS

= 16V, V

GS

= 0V

Gate-Source Leakage

I

GSS

±1

μA

V

GS

=

±4.5V, V

DS

= 0V

ON CHARACTERISTICS (Note 5)
Gate Threshold Voltage

V

GS(th)

0.5

1.0 V

V

DS

= V

GS

, I

D

= 250

μA

Static Drain-Source On-Resistance

R

DS (ON)

0.4
0.5

0.7

0.55
0.70

0.9

Ω

V

GS

= 4.5V, I

D

= 540mA

V

GS

= 2.5V, I

D

= 500mA

V

GS

= 1.8V, I

D

= 350mA

Forward Transfer Admittance

|Y

fs

|

200

ms

V

DS

=10V, I

D

= 0.2A

Diode Forward Voltage

V

SD

0.5

1.4 V

V

GS

= 0V, I

S

= 115mA

DYNAMIC CHARACTERISTICS (Note 6)
Input Capacitance

C

iss

150 pF

V

DS

= 16V, V

GS

= 0V

f = 1.0MHz

Output Capacitance

C

oss

25 pF

Reverse Transfer Capacitance

C

rss

20 pF

SWITCHING CHARACTERISTICS (Note 6)
Turn-On Delay Time

t

d(on)

8.0

ns

V

DD

= 10V, R

L

= 47

Ω,

I

D

= 200mA. V

GEN

= 4.5V,

R

G

= 10

Rise Time

t

r

13.3

ns

Turn-Off Delay Time

t

d(off)

53.5

ns

Fall Time

t

f

36.1

ns

Notes:

4. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
5. Short duration pulse test used to minimize self-heating effect.
6. Guaranteed by design. Not subject to product testing.