Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes DMN1150UFB User Manual
Page 2
DMN1150UFB
Document number: DS36101 Rev. 3 - 2
2 of 6
February 2013
© Diodes Incorporated
DMN1150UFB
ADVAN
CE I
N
F
O
RM
ATI
O
N
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
12 V
Gate-Source Voltage
V
GSS
±6 V
Continuous Drain Current (Note 5) V
GS
= 4.5V
Steady
State
T
A
= +25°C
T
A
= +70°C
I
D
1.41
1.15
A
Pulsed Drain Current (10μs pulse, duty cycle = 1%)
I
DM
7 A
Maximum Body Diode continuous Current
I
S
1 A
Thermal Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Total Power Dissipation (Note 5)
T
A
= +25°C
P
D
0.5
W
T
A
= +70°C
0.3
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
R
θJA
251 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 6)
Drain-Source Breakdown Voltage
BV
DSS
12 — — V
V
GS
= 0V, I
D
= 250μA
Zero Gate Voltage Drain Current T
J
= +25°C
I
DSS
— — 100 nA
V
DS
= 12V, V
GS
= 0V
Gate-Source Leakage
I
GSS
— — ±1 µA
V
GS
= ±6V, V
DS
= 0V
ON CHARACTERISTICS (Note 6)
Gate Threshold Voltage
V
GS(th)
0.35
—
1.0 V
V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance
R
DS (ON)
—
—
150
mΩ
V
GS
= 4.5V, I
D
= 1A
—
185
V
GS
= 2.5V, I
D
= 1A
—
210
V
GS
= 1.8V, I
D
= 1A
Diode Forward Voltage
V
SD
—
0.7
1.2
V
V
GS
= 0V, I
S
= 150mA
DYNAMIC CHARACTERISTICS (Note 7)
Input Capacitance
C
iss
— 106 — pF
V
DS
=10V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance
C
oss
— 23 — pF
Reverse Transfer Capacitance
C
rss
— 21 — pF
Gate resistance
R
g
—
92.4
—
Ω
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge (V
GS
= 4.5V)
Q
g
— 1.5 — nC
V
DS
= 4V, I
D
= 1A
Gate-Source Charge
Q
gs
— 0.2 — nC
Gate-Drain Charge
Q
gd
— 0.2 — nC
Turn-On Delay Time
t
D(on)
— 4.1 — ns
V
DD
= 4V,V
GS
= 6V, I
D
= 1A
R
G
= 1Ω
Turn-On Rise Time
t
r
—
34.5
—
ns
Turn-Off Delay Time
t
D(off)
— 57 — ns
Turn-Off Fall Time
t
f
— 30 — ns
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Short duration pulse test used to minimize self-heating effect.
7. Guaranteed by design. Not subject to product testing.