Diodes DMG3420U - Manual (Page 2)

DMG3420U
Document number: DS31867 Rev. 5 - 2
2 of 6
www.diodes.com
September 2013
© Diodes Incorporated
DMG3420U
NEW PROD
UC
T
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Value Units
Drain-Source Voltage V
DSS
20 V
Gate-Source Voltage V
GSS
±12 V
Continuous Drain Current (Note 6)
Steady
State
T
A
= +25°C
T
A
= +85°C
I
D
5.47
3.43
A
Pulsed Drain Current (Note 7) I
DM
20 A
Thermal Characteristics
Characteristic Symbol Value Unit
Power Dissipation (Note 6) P
D
0.74 W
Thermal Resistance, Junction to Ambient @T
A
= 25°C (Note 6) R
θJA
167 °C/W
Operating and Storage Temperature Range T
J,
T
STG
-55 to +150 °C
Electrical Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol Min Typ Max Unit Test Condition
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
BV
DSS
20 — — V V
GS
= 0V, I
D
= 250μA
Zero Gate Voltage Drain Current T
J
= +25°C I
DSS
— — 1.0 µA V
DS
= 20V, V
GS
= 0V
Gate-Source Leakage I
GSS
— — ±100 nA V
GS
= ±12V, V
DS
= 0V
ON CHARACTERISTICS (Note 8)
Gate Threshold Voltage
V
GS(th)
0.5 0.95 1.2 V V
DS
= V
GS
, I
D
= 250μA
Static Drain-Source On-Resistance R
DS(ON)
—
21 29
m 
V
GS
= 10V, I
D
= 6A
25 35 V
GS
= 4.5V, I
D
= 5A
34 48 V
GS
= 2.5V, I
D
= 4A
65 91 V
GS
= 1.8V, I
D
= 2A
Forward Transfer Admittance |Y
fs
| — 9 — S V
DS
= 5V, I
D
= 3.8A
Diode Forward Voltage V
SD
— 0.75 1.0 V V
GS
= 0V, I
S
= 1A
DYNAMIC CHARACTERISTICS (Note 9)
Input Capacitance
C
iss
— 434.7 — pF
V
DS
= 10V, V
GS
= 0V,
f = 1.0MHz
Output Capacitance C
oss
— 69.1 — pF
Reverse Transfer Capacitance C
rss
— 61.2 — pF
Gate Resistance R
g
— 1.53 —  V
DS
= 0V, V
GS
= 0V, f = 1MHz
Total Gate Charge Q
g
— 5.4 — nC
V
GS
= 4.5V, V
DS
= 10V,
I
D
= 6A
Gate-Source Charge Q
gs
— 0.9 — nC
Gate-Drain Charge Q
gd
— 1.5 — nC
Turn-On Delay Time t
D(on)
— 6.5 — ns
V
DD
= 10V, V
GS
= 5V,
R
L
= 1.7 , R
G
= 6 
Turn-On Rise Time t
r
— 8.3 — ns
Turn-Off Delay Time t
D(off)
— 21.6 — ns
Turn-Off Fall Time t
f
— 5.3 — ns
Notes: 6. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
7. Repetitive rating, pulse width limited by junction temperature.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to production testing.