Diodes DDTA (R2-ONLY SERIES) E - Manual

DS30320 Rev. 6 - 2 1 of 4
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DDTA (R2-ONLY SERIES) E
© Diodes Incorporated
DDTA
(R2-ONLY SERIES)
E DDTA
(R2-ONLY SERIES)
E
PNP PRE-BIASED SMALL SIGNAL SURFACE MOUNT TRANSISTOR
Features
• Epitaxial Planar Die Construction
• Complementary NPN Types Available (DDTC)
• Built-In Biasing Resistor, R2 only
• Lead Free/RoHS Compliant (Note 2)
• "Green" Device (Note 3 and 4)
Mechanical Data
NEW PROD
UC
T
• Case: SOT-523
• Case Material: Molded Plastic. UL Flammability
Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020C
• Terminals: Solderable per MIL-STD-202, Method 208
• Lead Free Plating (Matte Tin Finish annealed over
Alloy 42 leadframe).
•
Terminal Connections: See Diagram
• Marking & Date Code Information: See Diagrams &
Page 4
• Ordering Information: See Page 4
• Weight: 0.002 grams (approximate)
P/N R2 (NOM) MARKING
DDTA114GE
DDTA124GE
DDTA144GE
DDTA115GE 10K Ω
22K Ω
47K Ω
100K Ω
P26
P27
P28
P29
SOT-523
Dim Min Max Typ
A 0.15 0.30 0.22
B 0.75 0.85 0.80
C 1.45 1.75 1.60
D ⎯ ⎯ 0.50
G 0.90 1.10 1.00
H 1.50 1.70 1.60
J 0.00 0.10 0.05
K 0.60 0.80 0.75
L 0.10 0.30 0.22
M 0.10 0.20 0.12
N 0.45 0.65 0.50
α 0 ° 8 ° ⎯
All Dimensions in mm
A
M
J
L D
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol Value Unit
Collector-Base Voltage V
CBO
-50 V
Collector-Emitter Voltage V
CEO
-50 V
Emitter-Base Voltage V
EBO
-5 V
Collector Current I
C
(Max) -100 mA
Power Dissipation P
d
150 mW
Thermal Resistance, Junction to Ambient Air (Note 1) R
θJA
833 °C/W
Operating and Storage Temperature Range T
j
, T
STG
-55 to +150 °C
Notes: 1. Mounted on FR4 PC Board with recommended pad layout as shown on Diodes Inc., suggested pad layout document AP02001, which can be found on
our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
4. Product manufactured with Date Code UO (week 40, 2007) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code UO are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
B
R
2
SCHEMATIC DIAGRAM
E
C
B C
H
K
G
TOP VIEW
C
E B
N