Diodes 74AUP1G08 - Manual (Page 7)

74AUP1G08
Document number: DS35150 Rev. 2 - 2
7 of 14
www.diodes.com
July 2013
© Diodes Incorporated
74AUP1G08
Operating and Package Characteristics
(@T
A
= +25°C, unless otherwise specified.)
Parameter
Test
Conditions
V
CC
Typ Unit
C
pd
Power Dissipation
Capacitance f = 1MHz
No Load
0.8V 6.7
pF
1.2V ± 0.1V 6.6
1.5V ± 0.1V 6.5
1.8V ± 0.15V 6.5
2.5V ± 0.2V 6.4
3.3V ± 0.3V 6.3
C
i
Input Capacitance V
i
= V
CC
or GND 0V or 3.3V 1.5 pF
θ
JA
Thermal Resistance
Junction-to-Ambient
SOT353
(Note 6)
371
°C/W
X2-DFN0808-4 430
X2-DFN1010-6 445
X2-DFN1409-6 470
X2-DFN1410-6 460
θ
JC
Thermal Resistance
Junction-to-Case
SOT353
(Note 6
143
°C/W
X2-DFN0808-4 240
X2-DFN1010-6 250
X2-DFN1409-6 275
X2-DFN1410-6 265
Notes: 6. Test condition for , SOT353, X2-DFN0808-4:, X2-DFN1010-6 X2-DFN1409-6 and X2-DFN1410-6: Device mounted on FR-4 substrate PC board,
2oz copper, with minimum recommended pad layout.