Diodes AP3608E - Manual (Page 5)

EIGHT-CHANNEL CONSTANT CURRENT SINK WITH CURRENT MATCH AP3608E
5
Mar. 2011 Rev. 1. 5 BCD Semiconductor Manufacturing Limited
Data Sheet
Ordering Information
Package Temperature Range Part Number Marking ID Packing Type
QFN-4 × 4-24
-40 to 85 o C
AP3608EFNTR-G1 B3B Tape & Reel
TSSOP-20(EDP) AP3608EGTR-G1 AP3608EG-G1 Tape & Reel
SOIC-20
AP3608EM-G1 AP3608EM-G1 Tube
AP3608EMTR-G1 AP3608EM-G1 Tape & Reel
Circuit Type
Package
FN: QFN-4 × 4-24
G1: Green
AP3608E -
TR: Tape and Reel
BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green.
Parameter Symbol Value Unit
Input Voltage V
CC
-0.3 to 6 V
ISET Pin Voltage V
ISET
-0.3 to 6 V
EN Pin Voltage V
EN
-0.3 to 6 V
Feedback Pin Voltage V
FB
-0.3 to 6 V
SDB Pin Voltage V
SDB
-0.3 to 6 V
PWM Pin Voltage V
PWM
-0.3 to 6 V
Voltage per Channel (Note 3) V
CHX
-0.3 to 40 V
Thermal Resistance
(Junction to Ambient, No Heat Sink) θ
JA
QFN-4 ×4-24 60
o C/W
TSSOP-20(EDP) 35 (Note 2)
SOIC-20 87
Operating Junction Temperature T
J
150 o C
Storage Temperature Range T
STG
-65 to 150 o C
Lead Temperature (Soldering, 10sec) T
LEAD
260 o C
ESD (Machine Model) 200 V
ESD (Human Body Model) 6000 V
Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device.
These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated
under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods
may affect device reliability.
Note 2: The chip is soldered to 60mm
2 (4mm ×15mm) copper (top side solder mask) of 1oz. on PCB with 8×0.5mm vias.
Note 3: Breakdown voltage.
Absolute Maximum Ratings (Note 1)
G: TSSOP-20(EDP)
Blank: Tube
M: SOIC-20