Zxmp10a13f, Maximum ratings, Thermal characteristics – Diodes ZXMP10A13F User Manual
Page 2
ZXMP10A13F
Document number: DS33596 Rev. 3 - 2
2 of 8
October 2013
© Diodes Incorporated
ZXMP10A13F
A Product Line of
Diodes Incorporated
Maximum Ratings
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Units
Drain-Source Voltage
V
DSS
-100 V
Gate-Source Voltage
V
GS
±20 V
Continuous Drain Current
V
GS
= 10V
(Note 6)
T
A
= +70°C (Note 6)
(Note 5)
I
D
-0.7
-0.5
-0.6
A
Pulsed Drain Current (Note 7)
I
DM
-3.1 A
Continuous Source Current (Body Diode) (Note 6)
I
S
-1.1 A
Pulsed Source Current (Body Diode) (Note 7)
I
SM
-3.1 A
Thermal Characteristics
Characteristic Symbol
Value
Unit
Power Dissipation (Note 5)
Linear Derating Factor
P
D
625
5
mW
mW/°C
Power Dissipation (Note 6)
Linear Derating Factor
P
D
806
6.4
mW
mW/°C
Thermal Resistance, Junction to Ambient (Note 5)
R
θJA
200 °C/W
Thermal Resistance, Junction to Ambient (Note 6)
R
θJA
155 °C/W
Thermal Resistance, Junction to Leads (Note 8)
R
θJL
194 °C/W
Operating and Storage Temperature Range
T
J,
T
STG
-55 to +150
°C
Notes:
5. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions
6. For a device surface mounted on FR4 PCB measured at t ≤5 secs.
7. Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width=10μs - pulse current limited by maximum junction temperature.
8. Thermal resistance from junction to solder-point (at the end of the drain lead).