Maximum ratings, Thermal characteristics – Diodes ZXMP6A13G User Manual
Page 2
ZXMP6A13G
Document Number DS32032 Rev. 5 - 2
2 of 8
November 2011
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXMP6A13G
ADVAN
CE I
N
F
O
RM
ATI
O
N
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Unit
Drain-Source voltage
V
DSS
-60 V
Gate-Source voltage
V
GS
±20
V
Continuous Drain current
V
GS
= 10V
(Note 5)
I
D
-2.3
A
T
A
= 70°C (Note 5)
-1.9
(Note 4)
-1.7
Pulsed Drain current
V
GS
= 10V
(Note 6)
I
DM
-7.8 A
Continuous Source current (Body diode)
(Note 5)
I
S
-4.1 A
Pulsed Source current (Body diode)
(Note 6)
I
SM
-7.8 A
Thermal Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Unit
Power dissipation
Linear derating factor
(Note 4)
P
D
2.0
16
W
mW/
°C
(Note 5)
3.9
31
Thermal Resistance, Junction to Ambient
(Note 4)
R
θJA
62.5
°C/W
(Note 5)
32.0
Thermal Resistance, Junction to Lead
(Note 7)
R
θJL
9.8
Operating and storage temperature range
T
J
, T
STG
-55 to 150
°C
Notes:
4. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
5. Same as note (1), except the device is measured at t
≤ 10 sec.
6. Same as note (1), except the device is pulsed with D = 0.02 and pulse width 300µs. The pulse current is limited by the maximum junction temperature.
7. Thermal resistance from junction to solder-point (at the end of the drain lead).