Diodes ZXMP4A16K - Manual (Page 2)

ZXMP4A16K
Issue 1 - March 2006 2 www.zetex.com
© Zetex Semiconductors plc 2006
Absolute maximum rating
NOTES:
(a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 PCB with high coverage of single sided 2oz copper, in
still air conditions.
(b) For a device surface mounted on FR4 PCB measured at t
Յ
10 sec.
(c) Repetitive rating 50mm x 50mm x 1.6mm FR4 PCB, D=0.02 pulse width=300
␮
s - pulse width limited by maximum
junction temperature.
(d) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in
still air conditions.
Parameter Symbol Limit Unit
Drain-source voltage V
DSS
-40 V
Gate-source voltage V
GS
±20 V
Continuous drain current
I
D
V
GS
= -10V; T
A
=25°C
(b) -9.9 A
V
GS
= -10V; T
A
=70°C
(b) -8.0 A
V
GS
= -10V; T
A
=25°C
(a) -6.6 A
Pulsed drain current
(c) I
DM
-35 A
Continuous source current (body diode)
(b) I
S
-10.1 A
Pulsed source current (body diode)
(c) I
SM
-35 A
Power dissipation at T
A
=25°C
(a) P
D
4.2 W
Linear derating factor 33.6 mW/°C
Power dissipation at T
A
=25°C
(b) P
D
9.5 W
Linear derating factor 76 mW/°C
Power dissipation at T
A
=25°C
(d)
Linear derating factor
P
D
2.15
17.2 W
mW/°C
Operating and storage temperature range T
j
:T
stg
-55 to +150 °C
Thermal resistance
Parameter
Symbol
Value Unit
Junction to ambient
(a)
R
⍜JA
30 °C/W
Junction to ambient
(b)
R ⍜JA 13.2 °C/W
Junction to ambient
(d)
R ⍜JA 58 °C/W