Maximum ratings, Thermal characteristics, Electrical characteristics – Diodes ZXM66P02N8 User Manual
Page 2: A product line of diodes incorporated
ZXM66P02N8
Document Number DS31965 Rev. 2 - 2
2 of 5
October 2009
© Diodes Incorporated
A Product Line of
Diodes Incorporated
ZXM66P02N8
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Unit
Drain-Source voltage
V
DSS
-20 V
Gate-Source voltage
V
GS
±12
V
Continuous Drain current
V
GS
= 4.5V
(Note 3)
I
D
-8.0
A
T
A
= 70°C (Note 3)
-6.5
(Note 2)
-6.4
Pulsed Drain current
(Note 4)
I
DM
-28 A
Continuous Source current (Body diode)
(Note 3)
I
S
-4.15 A
Pulsed Source current (Body diode)
(Note 4)
I
SM
-28 A
Thermal Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Value
Unit
Power dissipation
Linear derating factor
(Note 2)
P
D
1.56
12.5
W
mW/
°C
(Note 3)
2.5
20
Thermal Resistance, Junction to Ambient
(Note 2)
R
θJA
80
°C/W
(Note 3)
50
Operating and storage temperature range
T
J
, T
STG
-55 to 150
°C
Notes:
2. For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions.
3. Same as note (3), except the device is measured at t
≤ 10 sec.
4. Repetitive rating 25mm x 25mm FR4 PCB, D = 0.05, pulse width 10
μs – pulse width limited by maximum junction temperature.
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic Symbol
Min
Typ
Max
Unit
Test
Condition
OFF CHARACTERISTICS
Drain-Source Breakdown Voltage
BV
DSS
-20
⎯
⎯
V
I
D
= -250
μA, V
GS
= 0V
Zero Gate Voltage Drain Current
I
DSS
⎯
⎯
-1
μA
V
DS
= -16V, V
GS
= 0V
Gate-Source Leakage
I
GSS
⎯
⎯
-100 nA
V
GS
=
±12V, V
DS
= 0V
ON CHARACTERISTICS
Gate Threshold Voltage
V
GS(th)
-0.7
⎯
⎯
V
I
D
= -250
μA, V
DS
= V
GS
Static Drain-Source On-Resistance (Note 5)
R
DS (ON)
⎯
⎯
0.025
Ω
V
GS
= -4.5V, I
D
= -3.2A
0.045
V
GS
= -2.5V, I
D
= -2.7A
Forward Transconductance (Notes 5 & 6)
g
fs
⎯
13.3
⎯
S
V
DS
= -10V, I
D
= -3.2A
Diode Forward Voltage (Note 5)
V
SD
⎯
⎯
0.95 V
I
S
= -3.2A, V
GS
= 0V
Reverse recovery time (Note 6)
t
rr
23.1
⎯
ns
I
F
= -3.2A, di/dt = 100A/
μs
Reverse recovery charge (Note 6)
Q
rr
⎯
12.2
⎯
nC
DYNAMIC CHARACTERISTICS (
Note 6
)
Input Capacitance
C
iss
⎯
2068
⎯
pF
V
DS
= -15V, V
GS
= 0V
F = 1MHz
Output Capacitance
C
oss
⎯
1038
⎯
pF
Reverse Transfer Capacitance
C
rss
⎯
506
⎯
pF
Total Gate Charge (Note 7)
Q
g
⎯
43.3
⎯
nC
V
GS
= -4.5V, V
DS
= -10V,
I
D
= -3.2A
Gate-Source Charge (Note 7)
Q
gs
⎯
3.5
⎯
nC
Gate-Drain Charge (Note 7)
Q
gd
⎯
21.3
⎯
nC
Turn-On Delay Time (Note 7)
t
D(on)
⎯
14.0
⎯
ns
V
DD
= -10V, V
GS
= -5V
I
D
= -3.2A, R
G
= 6.0
Ω
Turn-On Rise Time (Note 7)
t
r
⎯
44.3
⎯
ns
Turn-Off Delay Time (Note 7)
t
D(off)
⎯
118.4
⎯
ns
Turn-Off Fall Time (Note 7)
t
f
⎯
98.4
⎯
ns
Notes:
5. Measured under pulsed conditions. Pulse width
≤ 300μs; duty cycle ≤ 2%
6. For design aid only, not subject to production testing.
7. Switching characteristics are independent of operating junction temperatures.