Zxmn2amc, Thermal characteristics, Safe operating area – Diodes ZXMN2AMC User Manual
Page 3: Derating curve, Transient thermal impedance, Thermal resistance v board area, Power dissipation v board area
ZXMN2AMC
Document number: DS35089 Rev. 1 - 2
3 of 8
December 2010
© Diodes Incorporated
ZXMN2AMC
A Product Line of
Diodes Incorporated
Thermal Characteristics
1
10
10m
100m
1
10
0
25
50
75
100
125
150
0.0
0.5
1.0
1.5
2.0
100µ
1m
10m 100m
1
10
100
1k
0
20
40
60
80
0.1
1
10
100
0
25
50
75
100
125
150
175
200
225
0.1
1
10
100
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
8 sq cm 2oz Cu
One active die
100us
100ms
1s
R
DS(on)
Limited
1ms
Safe Operating Area
Single Pulse, T
amb
=25°C
DC
10ms
I
D
Dr
ain Cur
re
n
t (A
)
V
DS
Drain-Source Voltage (V)
10 sq cm 1oz Cu
One active die
10 sq cm 1oz Cu
Two active die
8 sq cm 2oz Cu
One active die
Derating Curve
M
a
x
P
o
we
r
Dis
s
ipat
ion
(W
)
Temperature (°C)
8 sq cm 2oz Cu
One active die
D=0.2
D=0.5
D=0.1
Transient Thermal Impedance
Single Pulse
D=0.05
The
rm
al
R
esi
st
anc
e (
°C
/W
)
Pulse Width (s)
2oz Cu
Two active die
1oz Cu
Two active die
1oz Cu
One active die
2oz Cu
One active die
2oz Cu
Two active die
Thermal Resistance v Board Area
The
rm
al
R
esi
st
anc
e (
°C
/W
)
Board Cu Area (sqcm)
1oz Cu
One active die
1oz Cu
Two active die
2oz Cu
One active die
Power Dissipation v Board Area
T
amb
=25°C
T
j max
=150°C
Continuous
P
D
Di
s
s
ipa
ti
on
(W)
Board Cu Area (sqcm)