Diodes SDM10M45SD User Manual
Sdm10m45sd, Features, Mechanical data
SDM10M45SD
Features
•
Fast Switching Speed
•
Ultra-Small Surface Mount Package
•
For General Purpose Switching Applications
•
High Conductance
•
Lead Free/RoHS Compliant (Note 3)
•
"Green" Device (Note 4 and 5)
Mechanical Data
•
Case: SOT-26
•
Case Material: Molded Plastic, "Green" Molding Compound,
Note 6. UL Flammability Classification 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed over Copper
leadframe).
•
Polarity: See Diagram
•
Marking Information: See Page 3
•
Ordering Information: See Page 3
•
Weight: 0.016 grams (approximate)
Top View
Device Schematic
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
V
RRM
V
RWM
V
R
45
V
RMS Reverse Voltage
V
R(RMS)
40
V
Forward Continuous Current (Note 1)
I
FM
100
mA
Forward Surge Current
@ t < 8.3ms
I
FSM
1.0
A
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 1)
P
D
225
mW
Thermal Resistance Junction to Ambient Air (Note 1)
R
θJA
444
°C/W
Operating and Storage Temperature Range
T
J
, T
STG
-40 to +125
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
Reverse Breakdown Voltage (Note 2)
V
(BR)R
45
⎯
⎯
⎯
I
R
= 100
μA
Forward Voltage
V
F
⎯
370
450
mV
I
F
= 10mA
Reverse Leakage Current (Note 2)
I
R
⎯
0.07
1.0
μA
V
R
= 10V
Total Capacitance
C
T
⎯
6.0
⎯
pF
V
R
= 10V, f = 1.0MHz
Notes:
1. Device mounted on FR-5 PCB 1.0 x 0.75 x 0.062 inch pad layout as shown on Diodes, Inc. suggested pad layout AP02001, which can be found on our
website at http://www.diodes.com/datasheets/ap02001.pdf.
2. Short duration pulse test used to minimize self-heating effect.
3. No purposefully added lead.
4. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php.
5. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
SDM10M45SD
Document number: DS30386 Rev. 6 - 2
1 of 3
www.diodes.com
July 2008
© Diodes Incorporated