Diodes SDM03U40 User Manual
Sdm03u40, Features, Mechanical data

SDM03U40
Document number: DS30392 Rev. 9 - 2
1 of 3
www.diodes.com
January 2009
© Diodes Incorporated
SDM03U40
SURFACE MOUNT SCHOTTKY BARRIER DIODE
Features
•
Low Forward Voltage Drop
•
Guard Ring Die Construction for Transient Protection
•
Ideal for low logic level applications
•
Low Capacitance
•
Lead Free by Design/RoHS Compliant (Note 1)
•
"Green" Device, Note 4 and 5
•
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
• Case:
SOD-523
•
Case Material: Molded Plastic, "Green" Molding Compound,
Note 5. UL Flammability Classification Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020D
•
Terminal Connections: Cathode Band
•
Terminals: Finish - Matte Tin annealed over Alloy 42 leadframe.
Solderable per MIL-STD-202, Method 208
•
Marking Information: See Page 3
•
Ordering Information: See Page 3
•
Weight: 0.002 grams (approximate)
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Peak Reverse Voltage
V
RM
40
V
DC Reverse Voltage
V
R
30
V
RMS Reverse Voltage
V
R(RMS)
21
V
Average Rectified Current
I
O
30
mA
Non-Repetitive Peak Forward Surge Current @8.3ms
Single half sine-wave superimposed on rated load
I
FSM
200
mA
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 2)
P
D
150
mW
Thermal Resistance, Junction to Ambient (Note 2)
R
θJA
667
°C/W
Operating and Storage Temperature Range
T
J,
T
STG
-40 to +125
°C
Electrical Characteristics
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Min
Typ
Max
Unit
Test Conditions
Reverse Breakdown Voltage (Note 3)
V
(BR)R
40
⎯
⎯
V
I
R = 10
uA
Forward Voltage
V
F
⎯
290
370
mV
I
F
= 1mA
Peak Reverse Current (Note 3)
I
R
⎯
⎯
0.5
μA
V
R
= 30V
Total Capacitance
C
T
⎯
2
⎯
pF
V
R
= 1V, f = 1.0 MHz
Notes:
1. No purposefully added lead.
2. Part mounted on FR-4 board with recommended pad layout, which can be found on our website at
4. Diodes Inc.'s "Green" Policy can be found on our website at
code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
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