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3 special features, 1 product highlights, Latest processor technology – Asus P5ND2 SE User Manual

Page 15: Intel, Core, 2 processor support, Enhanced intel speedstep, Technology (eist), Pci express™ interface

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ASUS P5ND2 SE

1-3

1.3

Special features

1.3.1 Product highlights

Latest processor technology

The motherboard comes with a 775-pin surface mount Land Grid Array

(LGA) socket designed for the Intel

®

Pentium

®

D, Intel

®

Pentium

®

4, and

Intel

®

Celeron

®

processors in the 775-land package. The motherboard

supports Intel

®

processors with 1066/800/533 MHz Front Side Bus (FSB).

The motherboard also supports the Intel

®

Hyper-Threading Technology,

Intel

®

Dual-Core Technology and is fully compatible with Intel

®

05B/05A and

06B processors. See page 1-9 for details.

Intel

®

Core

TM

2 Processor Support

This motherboard supports the latest Intel

®

Core

TM

2 processors in LGA775

package. With new Intel

®

Core microarchitecture technology and 1066/800

MHz FSB, Intel

®

Core

TM

2 processor is a very powerful and energy efficient CPU.

Enhanced Intel SpeedStep

®

Technology (EIST)

The Enhanced Intel SpeedStep

®

Technology (EIST) intelligently manages

the CPU resources by automatically adjusting the CPU voltage and core

frequency depending on the CPU loading and system speed or power

requirement.

Dual-channel DDR2 memory support

The motherboard supports DDR2 memory for flexible system upgrade and

to meet the higher bandwidth requirements of the latest 3D graphics,

multimedia, and Internet applications. The dual-channel architecture allows

memory bandwidths of up to 8.5 GB/s for DDR2. See page 1-16 for details.

PCI Express™ interface

The motherboard fully supports PCI Express, the latest I/O interconnect

technology that speeds up the PCI bus. PCI Express features point-to-point

serial interconnections between devices and allows higher clockspeeds by

carrying data in packets. This high speed interface is software compatible

with existing PCI specifications. See pages 1-23 for details.