Ironwood Electronics SS-BGA User Manual User Manual

Page 10

SSI.doc, Rev. A, IP

Rev. B/C/D, RP

Rev. E, VP

Tel: (800) 404-0204 • (952) 229-8200

Fax: (952) 229-8201

11351 Rupp Dr. Suite 400, Burnsville, MN 55337
www.ironwoodelectronics.com

• Regular visual inspection to identify abnormal wear and contaminants on the socket or test probes.

• Examine the composition of any debris present and determine its source. Try to minimize the

source of debris if possible.

• Verify that the socket is properly mounted to the load board and that it’s flush to the top surface of

the load board.

• Do not use any chemicals for cleaning the socket.
• Do not use any lubricants for test probe cleaning.

Light Cleaning Procedure

Required equipment needed:

• Soft to medium bristle nylon brush

• Set of screwdrivers

• Set of Hex / Allen wrenches
• Small electronics industrial vacuum

• Non-powdered latex or rubber gloves or finger cots

Cleaning Procedure

• Remove the socket from the load board and brush any debris from the solder pads of the load

board while vacuuming.

• If the socket is equipped with a manual lid remove or open it to gain access to the test probe tips.

• Hold the test socket in the vertical position, brush and vacuum at the same time to avoid any

contaminants going inside the socket or working their way into the test probe assembly. (This
operation is sometimes easier with two people)

• Rotate the socket 90 degrees and repeat the previous step.

• Brush and vacuum the socket including the nest if equipped.

• Re-assemble the socket onto the load board when cleaning is complete.

• If your test socket is to be put in storage it is recommended that the light cleaning procedure be

performed before storage so that any harmful contaminants left on the test probes do not harden
and become difficult to remove. For example solder buildup will oxidize over time and will
permanently damage probe tips.

• Always store the socket assembly in a dust free fully enclosed package.

What to avoid when cleaning

• Use of compressed air is strongly discouraged. Compressed Air will drive contaminants into the

internal working parts of the test probes.

• Do not apply solder or heat to the test probes.

• Use of alcohol or other cleaners can leave a residue and carry contaminants into the internal

working parts of the test probes.

• Repeated mechanical cleaning of the probe tips will shorten the time period between required

maintenance and more importantly it will start to remove surface plating which can result in
continuity issues as well as contact failures and elevated resistance.