Applications information, Ucsp applications information, Chip information – Rainbow Electronics MAX13045E User Manual

Page 10

MAX13042E–MAX13045E

1.62V to 3.6V Improved High-Speed LLT

______________________________________________________________________________________

Shutdown Mode

The MAX13042E–MAX13045E feature an enable (EN)
input that places the devices into a low-power shutdown
mode when driven low. The MAX13042E–MAX13045E
feature an automatic shutdown mode that disables the
part when V

is unconnected or less than V

Applications Information

Layout Recommendations

Use standard high-speed layout practices when
laying out a board with the MAX13042E–MAX13045E.
For example, to minimize line coupling, place all other
signal lines not connected to the MAX13042E–
MAX13045E at least 1x the substrate height of the
PCB away from the input and output lines of the
MAX13042E–MAX13045E.

Power-Supply Decoupling

To reduce ripple and the chance of introducing data
errors, bypass V

and V

to ground with 0.1µF ceram-

ic capacitors. Place all capacitors as close to the
power-supply inputs as possible. For full ESD protec-
tion, bypass V

with a 1µF ceramic capacitor located

as close to the V

input as possible.

Unidirectional vs. Bidirectional

Level Translator

The MAX13042E–MAX13045E bidirectional level trans-
lators can operate as a unidirectional device to trans-

late signals without inversion. These devices provide
the smallest solution (UCSP package) for unidirectional
level translation without inversion.

ESD Test Conditions

ESD performance depends on a variety of conditions.
Contact Maxim for a reliability report that documents
test setup, test methodology, and test results.

Use with External Pullup/

Pulldown Resistors

Due to the architecture of the MAX13042E–MAX13045E,
it is not recommended to use external pullup or pull-
down resistors on the bus. In certain applications, the
use of external pullup or pulldown resistors is desired to
have a known bus state when there is no active driver
on the bus. The MAX13042E–MAX13045E include inter-
nal pullup current sources that set the bus state when
the device is enabled. In shutdown mode, the state of
I/O V

CC_

and I/O V

is dependent on the selected part

version (see the Ordering Information/Selector Guide).

Open-Drain Signaling

The MAX13042E–MAX13045E are designed to pass open-
drain as well as CMOS push-pull signals. When used with
open-drain signaling, the rise time will be dominated by the
interaction of the internal pullup current source and the par-
asitic load capacitance. The MAX13042E–MAX13045E
include internal rise-time accelerators to speed up transi-
tions, eliminating any need for external pullup resistors. For
applications such as I

C or 1-wire that require an external

pullup resistor, please consult the MAX3378E and
MAX3396E data sheets.

UCSP Applications Information

For the latest application details on UCSP construction,
dimensions, tape carrier information, PCB techniques,
bump-pad layout, and recommended reflow temperature
profiles, as well as the latest information on reliability testing
results, go to Maxim’s website at www.maxim-ic.com/ucsp
to find the Application Note: UCSP – A Wafer-Level Chip-
Scale Package.

Chip Information

PROCESS: BiCMOS

µA

ENABLE

µA

BOOST

CIRCUIT

I/O V

BOOST

CIRCUIT

I/O V

CC_

NOTE: THE MAX13042E–MAX13045E ARE ENABLED WHEN
V

< V

AND EN = V

Figure 4. Simplified Functional Diagram for One I/O Line