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Vishay semiconductors, Thermal and mechanical specifications – C&H Technology VS-GT50TP120N User Manual

Page 4

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VS-GT50TP120N

www.vishay.com

Vishay Semiconductors

Revision: 17-May-13

3

Document Number: 94824

For technical questions within your region:

[email protected]

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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT

ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT

www.vishay.com/doc?91000

Fig. 1 - IGBT Typical Output Characteristics

Fig. 2 - IGBT Transfer Characteristics

Fig. 3 - IGBT Switching Loss vs. I

C

Fig. 4 - IGBT Switching Loss vs. R

G

THERMAL AND MECHANICAL SPECIFICATIONS

PARAMETER

SYMBOL

TEST CONDITIONS

MIN.

TYP.

MAX.

UNITS

Operating junction temperature

T

J

-

-

175

°C

Storage temperature range

T

Stg

- 40

-

125

°C

Junction to case

IGBT

R

thJC

-

-

0.37

K/W

Diode

-

-

0.49

Case to sink (Conductive grease applied)

R

thCS

-

0.05

-

Mounting torque

Power terminal screw: M5

2.5 to 5.0

Nm

Mounting screw: M6

3.0 to 5.0

Weight

Weight of module

-

150

-

g

0

10

20

30

40

50

60

70

80

90

100

25 °C

175 °C

V

CE

(V)

I

C

(A)

0

1

2

3

4

V

GE

= 15 V

0

2

6

4

8

10

12

V

GE

(V)

I

C

(A)

V

CE

= 50 V

0

10

20

30

40

50

60

70

80

90

100

175 °C

25 °C

0

25

75

50

100

I

C

(A)

E (mJ)

0

2

4

6

8

10

12

14

16

18

20

V

GE

= ± 15 V

T

J

=

125 °C

R

g

=15

Ω

V

CC

= 600 V

E

off

E

on

R

g

(

Ω)

E

(mJ)

0

10

30

20

40

50

60

0

8

4

2

6

10

12

14

16

18

20

E

on

E

off

V

GE

= ± 15 V

T

J

=

125 °C

I

C

= 50 A

V

CC

= 600 V