Vsk.f200..p series, Vishay high power products, Power modules), 200 a – C&H Technology VSK.F200..P Series User Manual
Page 4

Document Number: 94422
For technical questions, contact: [email protected]
www.vishay.com
Revision: 03-Jun-08
3
VSK.F200..P Series
Fast Thyristor/Diode and Thyristor/Thyristor
(MAGN-A-PAK
TM
Power Modules), 200 A
Vishay High Power Products
SWITCHING
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
K
J
Maximum non-repetitive rate of rise
dI/dt
Gate drive 20 V, 20
Ω, t
r
≤ 1 ms, V
D
= 80 % V
DRM
,
T
J
= 25 °C
800
A/µs
Maximum recovery time
t
rr
I
TM
= 350 A, dI/dt = - 25 A/µs, V
R
= 50 V, T
J
= 25 °C
2
µs
Maximum turn-off time
t
q
I
TM
= 750 A; T
J
= T
J
maximum; dI/dt = - 25 A/µs;
V
R
= 50 V; dV/dt = 400 V/µs linear to 80 % V
DRM
20
25
BLOCKING
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum critical rate of rise of
off-state voltage
dV/dt T
J
= 125 °C, exponential to 67 % V
DRM
1000
V/µs
RMS insulation voltage
V
INS
50 Hz, circuit to base, T
J
= 25 °C, t = 1 s
3000
V
Maximum peak reverse and off-state
leakage current
I
RRM
,
I
DRM
T
J
= 125 °C, rated V
DRM
/V
RRM
applied
50
mA
TRIGGERING
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum peak gate power
P
GM
f = 50 Hz, d% = 50
60
W
Maximum peak average gate power
P
G(AV)
T
J
= 125 °C, f = 50 Hz, d% = 50
10
Maximum peak positive gate current
I
GM
T
J
= 125 °C, t
p
≤ 5 ms
10
A
Maximum peak negative gate voltage
-V
GT
5
V
Maximum DC gate current required to trigger
I
GT
T
J
= 25 °C, V
ak
12 V, Ra = 6
200
mA
DC gate voltage required to trigger
V
GT
3
V
DC gate current not to trigger
I
GD
T
J
= 125 °C, rated V
DRM
applied
20
mA
DC gate voltage not to trigger
V
GD
0.25
V
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TEST CONDITIONS
VALUES
UNITS
Maximum junction operating
temperature range
T
J
- 40 to 125
°C
Storage temperature range
T
Stg
- 40 to 150
Maximum thermal resistance,
junction to case per junction
R
thJC
DC operation
0.125
K/W
Maximum thermal resistance,
case to heatsink per module
R
thC-hs
Mounting surface flat, smooth and greased
0.025
Mounting torque ± 10 %
MAP to heatsink
A mounting compound is recommended. The torque
should be rechecked after a period of 3 hours to
allow for the spread of the compound. Use of cable
lugs is not recommended, busbar should be used
and restrained during tightening. Threads must be
lubricated with a compound.
4 to 6
(35 to 53)
N · m
(lbf · in)
busbar to MAP
Approximate weight
500
g
17.8
oz.