Philips TDA6107AJF - Manual (Page 16)

© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
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consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 28 April 2005
Document number: 9397 750 14728
Published in The Netherlands
Philips Semiconductors
TDA6107AJF
Triple video output amplifier
20. Contents
1 General description . . . . . . . . . . . . . . . . . . . . . . 1
2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1
4 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
5 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
5.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
5.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
6 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 4
7 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
8 Thermal characteristics. . . . . . . . . . . . . . . . . . . 5
8.1 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5
9 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
10 Application information. . . . . . . . . . . . . . . . . . . 9
10.1 Cathode output . . . . . . . . . . . . . . . . . . . . . . . . . 9
10.2 Flashover protection . . . . . . . . . . . . . . . . . . . . . 9
10.3 Switch-off behavior . . . . . . . . . . . . . . . . . . . . . 10
10.4 Bandwidth . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
10.5 Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
11 Test information . . . . . . . . . . . . . . . . . . . . . . . . 11
11.1 Quality information . . . . . . . . . . . . . . . . . . . . . 11
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
13 Handling information. . . . . . . . . . . . . . . . . . . . 13
14 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14.1 Introduction to soldering through-hole mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14.2 Soldering by dipping or by solder wave . . . . . 13
14.3 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 13
14.4 Package related soldering information . . . . . . 13
15 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
16 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 15
17 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
18 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
19 Contact information . . . . . . . . . . . . . . . . . . . . 15