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Package outline, Tea5880ts, Philips semiconductors – Philips TEA5880TS User Manual

Page 21: Fig 12. package outline

background image

9397 750 13022

© Koninklijke Philips Electronics N.V. 2004. All rights reserved.

Preliminary data sheet

Rev. 02 — 26 April 2004

21 of 27

Philips Semiconductors

TEA5880TS

Integrated FM stereo radio IC for host processor tuning

16. Package outline

Fig 12. Package outline.

UNIT

A

1

A

2

A

3

b

p

c

D

(1)

E

(1)

(1)

e

H

E

L

L

p

Q

Z

y

w

v

θ

REFERENCES

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

JEDEC

JEITA

mm

0.21
0.05

1.80
1.65

0.38
0.25

0.20
0.09

8.4
8.0

5.4
5.2

0.65

1.25

7.9
7.6

0.9
0.7

0.8
0.4

8
0

o

o

0.13

0.1

0.2

DIMENSIONS (mm are the original dimensions)

Note

1. Plastic or metal protrusions of 0.2 mm maximum per side are not included.

1.03
0.63

SOT340-1

MO-150

99-12-27
03-02-19

X

w

M

θ

A

A

1

A

2

b

p

D

H

E

L

p

Q

detail X

E

Z

e

c

L

v

M

A

(A )

3

A

1

12

24

13

0.25

y

pin 1 index

0

2.5

5 mm

scale

SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm

SOT340-1

A

max.

2