Ironwood Electronics Solder Column Interface Soldering Techniques - Manual

Page 1 of 2 filename:FSI.doc, Rev A
Solder Column Interface Soldering Techniques
Tel: (800) 404-0204
www.ironwoodelectronics.com
Target PCBs, which are intended to accept the
Ironwood Electronics adapter with solder column
can vary greatly in size, mass, and thickness.
There are also several manufacturing processes
that can be used to attach adapters with solder
columns to target PCBs. Because of these wide
ranges in customer target PCB specifications and
process scenarios, Ironwood Electronics can offer
only general soldering instructions.
Ironwood's solder column part closely emulates
BGA package technology and can use similar
processes to attach to a target board. The
recommended method is explained below
with visual aids showing the step-by-step
process. This method has produced very
good results. Figure 1 shows the surface
mount solder column part (on the right) and
a clean target printed circuit board. The
bottom side of the surface mount foot has
the solder column. The steps involved in the
soldering process are as follows:
(1) Using a flux dispenser, place a small
amount of Tac flux (water soluble or no
clean) on the four inside corners of the target PCB lands as shown in Figure 2.
(2) Note the target board land pattern orientation and the adapter Pin 1 location. Place the
adapter onto the flux and land pattern as shown in Figure 3. Handling the adapter with a
vacuum pen, align on the land pattern of target PCB.
(3) Apply a generous amount of flux along each
side of the part as shown in Figure 3.
(4) Surface tension between the adapter's solder
columns and the target PCB's pads should self-
align the part during the reflow process.
(5) Reflow:
•
Use caution when profiling to insure minimal
temperature difference (<15
0
C and preferably
<10 0 C) between components.
Figure 1: Target PCB/Solder Column Foot
Figure 2: Placing Tac Flux
Figure 3: Applying Flux