HP PAVILION DV3 User Manual
Page 67
4.
Remove the fan/heat sink assembly (3).
NOTE:
The thermal material must be thoroughly cleaned from the surfaces of the fan/heat sink
assembly (1), (3), and (5); the processer (2); capacitor (6); and the graphics chip (4) each time the heat
sink is removed. Thermal pads and thermal paste must be installed on all surfaces before the heat sink
is reinstalled. Thermal pads and thermal paste are included with all heat sink, system board, and
processor spare part kits.
Reverse this procedure to install the fan/heat sink assembly.
Component replacement procedures
59
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