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Quickspecs, Hp compaq dx2250 microtower business pc – HP DX2250 User Manual

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Technology and Features

Technology and Features

Technology and Features

Technology and Features Memory Type

Memory Type

Memory Type

Memory Type

PC2-5300 DDR2 SDRAM (667-MHz) non-ECC
2 GB maximum system memory

Hard Drive Interfaces

Hard Drive Interfaces

Hard Drive Interfaces

Hard Drive Interfaces
Supported

Supported

Supported

Supported

Serial ATA 3.0-Gb/s hard drives are supported

Chassis

Chassis

Chassis

Chassis

Front Panel

Front Panel

Front Panel

Front Panel

Power button
Power On LED
HDD Activity LED

Cooling Solutions

Cooling Solutions

Cooling Solutions

Cooling Solutions
Supported

Supported

Supported

Supported

Power Supply Fan (variable speed)
Aluminum active heatsink (variable speed)
Chassis fan (variable speed)

Slots Supported

Slots Supported

Slots Supported

Slots Supported

Four (4) full-height expansion slots

Front I/O

Front I/O

Front I/O

Front I/O

Two (2) USB 2.0 ports

Rear I/O

Rear I/O

Rear I/O

Rear I/O

Standard Micro ATX I/O connectors, including four (4) USB 2.0 ports

Drive Bays

Drive Bays

Drive Bays

Drive Bays

Two (2) 5-1/4” external
One (1) 3-1/2” external
Two (2) 3-1/2” internal

Internal Speaker

Internal Speaker

Internal Speaker

Internal Speaker

Standard

Security

Security

Security

Security

Padlock loop

Power Supply

Power Supply

Power Supply

Power Supply

250-watt ATX Power Supply – PFC/non-PFC with a 115v/230v line switch
(varies by country/region)

Unit Environment and

Unit Environment and

Unit Environment and

Unit Environment and
Operating Conditions

Operating Conditions

Operating Conditions

Operating Conditions

General Unit Operating Guidelines

General Unit Operating Guidelines

General Unit Operating Guidelines

General Unit Operating Guidelines

Keep the computer away from excessive moisture, direct moisture and the extremes of heat and
cold, to ensure that unit is operated within the specified operating range.
Leave a 4 in (10.2 cm) clearance on all vented sides of the computer to permit the required
airflow.
Never restrict airflow into the computer by blocking any vents or air intakes.
Do not stack computers on top of each other or place computers so near each other that they are
subject to each other's re-circulated or preheated air.
Occasionally clean the air vents on the front, back, and any other vented side of the computer.
Lint, dust and other foreign matter can block the vents and limit the airflow.
If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must
be provided on the enclosure, and the same operating guidelines listed above will still apply.

Temperature Range

Temperature Range

Temperature Range

Temperature Range

Operating: 50° to 95° F (10° to 35° C)
Non-operating: –22° to 140° F (–30° to 60° C)

Relative Humidity

Relative Humidity

Relative Humidity

Relative Humidity

Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 5% to 95% (non-condensing at ambient)

Maximum Altitude

Maximum Altitude

Maximum Altitude

Maximum Altitude
(unpressurized)

Operating: 10,000 ft (3048 m)
Non-operating: 30,000 ft (9000 m)

NOTE:

NOTE:

NOTE:

NOTE: Operating temperature is de-rated 1.0 deg C per 1000 ft (300 m) to 10,000 ft (3000 m) above
sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be
limited by the type and number of options installed.

System Board

System Board

System Board

System Board

Processor

Processor

Processor

Processor

Socket AM2 industry standard Micro ATX form factor

QuickSpecs

HP Compaq dx2250 Microtower Business PC

HP Compaq dx2250 Microtower Business PC

HP Compaq dx2250 Microtower Business PC

HP Compaq dx2250 Microtower Business PC

System Details

DA - 12605 Canada — Version 18 — March 24, 2008

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