Quickspecs, Hp compaq dx2250 microtower business pc – HP DX2250 User Manual
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Technology and Features
Technology and Features
Technology and Features
Technology and Features Memory Type
Memory Type
Memory Type
Memory Type
PC2-5300 DDR2 SDRAM (667-MHz) non-ECC
2 GB maximum system memory
Hard Drive Interfaces
Hard Drive Interfaces
Hard Drive Interfaces
Hard Drive Interfaces
Supported
Supported
Supported
Supported
Serial ATA 3.0-Gb/s hard drives are supported
Chassis
Chassis
Chassis
Chassis
Front Panel
Front Panel
Front Panel
Front Panel
Power button
Power On LED
HDD Activity LED
Cooling Solutions
Cooling Solutions
Cooling Solutions
Cooling Solutions
Supported
Supported
Supported
Supported
Power Supply Fan (variable speed)
Aluminum active heatsink (variable speed)
Chassis fan (variable speed)
Slots Supported
Slots Supported
Slots Supported
Slots Supported
Four (4) full-height expansion slots
Front I/O
Front I/O
Front I/O
Front I/O
Two (2) USB 2.0 ports
Rear I/O
Rear I/O
Rear I/O
Rear I/O
Standard Micro ATX I/O connectors, including four (4) USB 2.0 ports
Drive Bays
Drive Bays
Drive Bays
Drive Bays
Two (2) 5-1/4” external
One (1) 3-1/2” external
Two (2) 3-1/2” internal
Internal Speaker
Internal Speaker
Internal Speaker
Internal Speaker
Standard
Security
Security
Security
Security
Padlock loop
Power Supply
Power Supply
Power Supply
Power Supply
250-watt ATX Power Supply – PFC/non-PFC with a 115v/230v line switch
(varies by country/region)
Unit Environment and
Unit Environment and
Unit Environment and
Unit Environment and
Operating Conditions
Operating Conditions
Operating Conditions
Operating Conditions
General Unit Operating Guidelines
General Unit Operating Guidelines
General Unit Operating Guidelines
General Unit Operating Guidelines
Keep the computer away from excessive moisture, direct moisture and the extremes of heat and
cold, to ensure that unit is operated within the specified operating range.
Leave a 4 in (10.2 cm) clearance on all vented sides of the computer to permit the required
airflow.
Never restrict airflow into the computer by blocking any vents or air intakes.
Do not stack computers on top of each other or place computers so near each other that they are
subject to each other's re-circulated or preheated air.
Occasionally clean the air vents on the front, back, and any other vented side of the computer.
Lint, dust and other foreign matter can block the vents and limit the airflow.
If the computer is to be operated within a separate enclosure, intake and exhaust ventilation must
be provided on the enclosure, and the same operating guidelines listed above will still apply.
Temperature Range
Temperature Range
Temperature Range
Temperature Range
Operating: 50° to 95° F (10° to 35° C)
Non-operating: –22° to 140° F (–30° to 60° C)
Relative Humidity
Relative Humidity
Relative Humidity
Relative Humidity
Operating: 10% to 90% (non-condensing at ambient)
Non-operating: 5% to 95% (non-condensing at ambient)
Maximum Altitude
Maximum Altitude
Maximum Altitude
Maximum Altitude
(unpressurized)
Operating: 10,000 ft (3048 m)
Non-operating: 30,000 ft (9000 m)
NOTE:
NOTE:
NOTE:
NOTE: Operating temperature is de-rated 1.0 deg C per 1000 ft (300 m) to 10,000 ft (3000 m) above
sea level, no direct sustained sunlight. Maximum rate of change is 10 deg C/Hr. The upper limit may be
limited by the type and number of options installed.
System Board
System Board
System Board
System Board
Processor
Processor
Processor
Processor
Socket AM2 industry standard Micro ATX form factor
QuickSpecs
HP Compaq dx2250 Microtower Business PC
HP Compaq dx2250 Microtower Business PC
HP Compaq dx2250 Microtower Business PC
HP Compaq dx2250 Microtower Business PC
System Details
DA - 12605 Canada — Version 18 — March 24, 2008
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