Olson Technology OTPN-MDN-870 - Manual (Page 2)

025-000556 Rev X4 31 Aug 2011 Page 2 of 11
Installation Instructions
1.1 General Installation Requirements
The installation of these units is very simple. There are no special unpacking instructions, except that care should be taken to
handle units gently. Fiber optic links are sensitive electronics devices that should be handled with care. The units are suscepti-
ble to ESD. Proper ESD techniques, such as wearing a wrist grounding strap, should be observed at all times when handling a
unit. The units should not be dropped.
Do not install the equipment near sources of excessive heat, such as furnace outlets or above heat producing units, such as
large power supplies and tube-type equipment. Observe temperature and relative humidity requirements limits.
1.2 Items Provided
The following is a list of items provided with each Model OTPN-MDN-870 Mini Digital Node:
Qty. Mfr. P/N Description
AR Olson Tech. OTPN-MDN-870 Fiber Optic Mini Digital Node
1.3 Items Required
Qty. Mfr. P/N Description
AR Olson Tech. OTOT-1000 LaserLite 1310nm 1,000MHz Forward Path Transmitter
1 per Rx Olson Tech. OTPS-12A-4W
Rx Power Supply, +12 Volts, 1.5A DC Power Supply, with 4-pin Weidmul-
ler Power Connector
4 per unit Any Any 6-32 Pan head Mounting Screws with Lock Washers and Nuts (For Rx)
1 Any Any Screwdriver
AR Any Any 9/125  m Single-mode Fiber
1.4 Inspection
Remove the unit from its shipping container. Any in-shipment damage that may have occurred should be visually apparent.
Look for bent or damaged connectors or mounting brackets. Claims for damage incurred in shipment should be made directly
to the transportation company in accordance with their instructions. Save the shipping cartons until installation and perform-
ance verification are completed.
1.5 Module Placement
Units may be mounted in any orientation on most flat, dry surfaces. Secure pan head screws through mounting holes provided
at the base of the module. If the unit is placed in a location where ambient temperatures may exceed +38°C (100°F), a good
heat sink should be used. In that case, the use of silicone thermal pads is recommended between the module and the plate to
maximize heat transfer. Units must have their chassis connected to a good earth ground.