DFI CR900-B - Manual (Page 6)

www.dfi .com Chapter 1 Introduction
6
SSD (optional) • 4GB/8GB/16GB/32GB
• Write: 30MB/sec (max), Read: 70MB/sec (max)
• SATA to SSD onboard
Trusted
Platform
Module (TPM) -
optional
• Provides a Trusted PC for secure transactions
• Provides software license protection, enforcement and password protection
Expansion
Interfaces
• Supports 8 USB 2.0/1.1 interfaces
• Supports 4 PCI slots (PCI 2.3 interface)
• Supports 1 PCIe x16 interface
- Supports Gen 3.0 (3rd generation processors)
- Supports Gen 2.0 (2nd generation processors)
- Confi gurations (supported only via a riser card):
: One x8 (GFX) and two x4 (I/O)
: Two x8 (GFX, I/O)
: One x16 (GFX, I/O)
• Supports 1 PCIe x1 and 1 PCIe x4 (default); or 5 PCIe x1 interfaces
• Supports LPC interface
• Supports SMBus interface
• Supports I 2 C interface
• Supports IDE interface
• Supports 4-bit input and 4-bit output GPIO
Damage Free
Intelligence
• Monitors CPU temperature
• Monitors CPU fan speed
• Monitors Vcore/VGFX/DDR/1.05V/VCCSA voltages
• Watchdog timer function
BIOS • 64Mbit SPI BIOS
Power
Consumption
• 59.78 W with i7-3610QE at 2.30GHz and 2x 1GB DDR3 SODIMM
OS Support • Windows XP Professional x86 & SP3 (32-bit)
• Windows XP Professional x64 & SP2 (64-bit)
• Windows 7 Ultimate x86 & SP1 (32-bit)
• Windows 7 Ultimate x64 & SP1 (64-bit)
• Windows 8 Enterprise x86 (32-bit)
• Windows 8 Enterprise x64 (64-bit)
Temperature • Operating: 0 o C to 60 o C
• Storage: -20 o C to 85 o C
Humidity • 10% to 90%
Power • Input: 5VSB (option), 12V, VCC_RTC
PCB • Dimensions
- COM Express Basic
- 95mm (3.74") x 125mm (4.9")
• Compliance
- PICMG COM Express R2.1 basic form factor, Type 2
Certifi cation • CE, FCC Class B, RoHS, UL
Chapter 1 - Introduction
Specifications
Processor • Socket G2 988B for:
- 3rd Generation Intel ® Core TM processors (22nm process technology)
: Intel ® Core™ i7-3610QE (6M Cache, up to 3.3 GHz); 45W
: Intel ® Core™ i5-3610ME (3M Cache, up to 3.3 GHz); 35W
: Intel ® Core™ i3-3120ME (3M Cache, 2.4 GHz); 35W
- 2nd Generation Intel ® Core TM processors (32nm process technology)
: Intel ® Core™ i7-2710QE (6M Cache, up to 3.0 GHz); 45W
: Intel ® Core™ i5-2510E (3M Cache, up to 3.1 GHz); 35W
: Intel ® Core™ i3-2330E (3M Cache, 2.2 GHz); 35W
: Intel ® Celeron ® B810 (2M Cache, 1.6 GHz); 35W
Chipset • Intel ® QM77 Express Chipset
System Memory • Two 204-pin SODIMM sockets
• Supports DDR3 SODIMM
• Supports DDR3L SODIMM
- 1066/1333MHz when operating at 1.35V
- 1066/1333/1600MHz when operating at 1.5V
• Supports dual channel memory interface
• Supports up to 16GB system memory
• DRAM device technologies: 1Gb, 2Gb and 4Gb DDR3 DRAM technologies are
supported for x8 and x16 devices, unbuffered, non-ECC
Graphics • Intel ® HD Graphics 4000
• Supports LVDS and VGA interfaces
• VGA: resolution up to 2048x1536 @ 75Hz
• LVDS: Single Channel - 18/24-bit; Dual Channel: 36/48-bit, resolution up to
1920x1200 @ 60Hz
• Intel ® Clear Video Technology
• DirectX Video Acceleration (DXVA) for accelerating video processing
- Full AVC/VC1/MPEG2 HW Decode
• Supports DirectX 11/10.1/10/9 and OpenGL 3.0
Audio • Supports High Defi nition Audio interface
LAN • Intel ® 82579LM Gigabit Ethernet PHY
• Integrated 10/100/1000 transceiver
• Fully compliant with IEEE 802.3, IEEE 802.3u, IEEE 802.3ab
Serial ATA • Supports 4 Serial ATA interfaces
• 2 SATA 3.0 with data transfer rate up to 6Gb/s
2 SATA 2.0 with data transfer rate up to 3Gb/s
• Integrated Advanced Host Controller Interface (AHCI) controller
• Supports RAID 0/1/5/10
IDE Interface • Supports up to two IDE devices
• DMA mode: Ultra ATA up to 100MB/s
• PIO mode: up to 16MB/s
Watchdog
Timer
• Watchdog timeout programmable via software from 1 to 255 seconds
Chapter 1
3rd Generation Processors 2nd Generation Processors
DDR3 1066/1333/1600MHz DDR3 1066/1333MHz (i5/i3/Celeron)
DDR3 1600MHz (i7)