BECKHOFF CB3060 - Manual (Page 14)

Chapter: Overview Specifications and Documents
page 14 Beckhoff New Automation Technology CB3060
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
 PCI specification
Version 2.3 resp. 3.0
www.pcisig.com
 Mini-PCI specification
Version 1.0
www.pcisig.com
 PCI Express® Base specification
Version 2.0
www.pcisig.com
 ACPI specification
Version 5.0
www.acpi.info
 USB specifications
www.usb.org
 SM-Bus specification
Version 2.0
www.smbus.org
 Intel® Chip Description
4th Gen. Intel® Core™ Processor Family Mobile datasheet
www.intel.com
 Intel® Chipset Description
Intel® 8 Series Chipset datasheet
www.intel.com
 Intel® Chip Description
i210 Datasheet
www.intel.com
 Intel® Chip Description
i218 Datasheet
www.intel.com
 Realtek® Chip Description
ALC885/889 Datasheet
www.realtek.com.tw
 SMSC® Chip Description
SCH3114 Datasheet
www.smsc.com
(NDA required)
 American Megatrends®
Aptio™ Text Setup Environment (TSE) User Manual
www.ami.com
 American Megatrends®
Aptio™ 4.x Status Codes
www.ami.com