BECKHOFF CB3052 User Manual
Page 4
Contents
page 4
Beckhoff New Automation Technology CB3052
4.4.1
CPU Feature ....................................................................................................................... 47
4.4.2
Hard Disk Boot Priority ........................................................................................................ 48
4.5
Advanced Chipset Features ........................................................................................................ 49
4.5.1
PCI Express Root Port Function ......................................................................................... 50
4.6
Integrated Peripherals ................................................................................................................. 51
4.6.1
OnChip IDE Devices ........................................................................................................... 52
4.6.2
Onboard Devices ................................................................................................................. 54
4.6.3
SuperIO Devices ................................................................................................................. 55
4.6.4
USB Device Setting ............................................................................................................. 56
4.7
Power Management Setup .......................................................................................................... 57
4.7.1
PCI Express PM Function ................................................................................................... 59
4.7.2
Intel DTS Feature ................................................................................................................ 60
4.8
PnP/PCI Configuration ................................................................................................................ 61
4.8.1
IRQ Resources .................................................................................................................... 63
4.9
PC Health Status ......................................................................................................................... 64
4.10
Frequency/Voltage Control ......................................................................................................... 65
4.11
Load Fail-Safe Defaults ............................................................................................................... 66
4.12
Load Optimized Defaults ............................................................................................................. 66
4.13
Set Password .............................................................................................................................. 66
4.14
Save & Exit Setup ....................................................................................................................... 66
4.15
Exit Without Saving ..................................................................................................................... 66
5
BIOS update ....................................................................................................................................... 67
6
Mechanical Drawing ........................................................................................................................... 68
6.1
PCB: Mounting Holes .................................................................................................................. 68
6.2
PCB: Pin 1 Dimensions ............................................................................................................... 69
6.3
PCB: Heat Sink ........................................................................................................................... 70
7
Technical Data .................................................................................................................................... 71
7.1
Electrical Data ............................................................................................................................. 71
7.2
Environmental Conditions ........................................................................................................... 71
7.3
Thermal Specifications ................................................................................................................ 72
8
Support and Service ........................................................................................................................... 73
8.1
Beckhoff's Branch Offices and Representatives ......................................................................... 73
8.2
Beckhoff Headquarters................................................................................................................ 73
8.2.1
Beckhoff Support ................................................................................................................. 73
8.2.2
Beckhoff Service ................................................................................................................. 73
I
Annex: Post-Codes ............................................................................................................................. 74
II
Annex: Resources .............................................................................................................................. 77
A
IO Range ......................................................................................................................................... 77
B
Memory Range ................................................................................................................................ 77
C
Interrupt ........................................................................................................................................... 77
D
PCI Devices ..................................................................................................................................... 78
E
SMB Devices ................................................................................................................................... 78