BECKHOFF CB3052 - Manual (Page 12)

Chapter: Overview Specifications and Documents
page 12 Beckhoff New Automation Technology CB3052
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation, the following documents,
specifications and web-pages were used and are recommended.
§ PCI specification
Version 2.3 resp. 3.0
www.pcisig.com
§ Mini-PCI specification
Version 1.0
www.pcisig.com
§ ACPI specification
Version 3.0
www.acpi.info
§ ATA/ATAPI specification
Version 7 Rev. 1
www.t13.org
§ USB specifications
www.usb.org
§ SM-Bus specification
Version 2.0
www.smbus.org
§ Intel®-Chip Description
Celeron® M, Core™ 2 Duo
www.intel.com
§ Intel® Chipset Description
Intel® 4 Series Express Chipset Family datasheet
www.intel.com
§ Intel® Chip Description
Intel® ICH9 Datasheet
www.intel.com
§ Intel® Chip Description
82574L Datasheet
www.intel.com
§ Intel® Chip Description
82567 Datasheet
www.intel.com
§ Realtek® Chip Description
ALC885/889 Datasheet
www.realtek.com.tw
§ SMSC® Chip Description
SCH3114 Datasheet
www.smsc.com
(NDA required)
§ IDT® Chip Description
ICS9LPRS501SKLF Datasheet
www.idt.com
§ Chrontel® Chip Description
Chrontel 7318C Datasheet
www.chrontel.com