BECKHOFF CB2051 - Manual (Page 12)

Chapter: Overview Specifications and Documents
page 12 Beckhoff New Automation Technology CB2051
2.2 Specifications and Documents
In making this manual and for further reading of technical documentation the following documents,
specifications and web-pages were used and are recommended.
§ PISA Specification
Version 1.8
us.kontron.com
§ PCI Specification
Version 2.3 resp. 3.0
www.pcisig.com
§ Mini-PCI Specification
Version 1.0
www.pcisig.com
§ ACPI Specification
Version 3.0
www.acpi.info
§ ATA/ATAPI Specification
Version 7 Rev. 1
www.t13.org
§ USB Specifications
www.usb.org
§ SM-Bus Specification
Version 2.0
www.smbus.org
§ Intel Chipset Description
Mobile Intel 945 Express Chipset Family Datasheet
www.intel.com
§ Intel Chip Description
ICH7 Datasheet
www.intel.com
§ Intel Chip Descriptions
Celeron M, Core Duo/Solo, Core2 Duo
www.intel.com
§ Winbond Chip Description
W83627HG Datasheet
www.winbond-usa.com oder www.winbond.com.tw
§ Intel Chip Description
82562EZ/GZ Datasheet
www.intel.com
§ Intel Chip Description
82573L(E) Datasheet
www.intel.com
§ IDT Chip Description
IDTCV111i Datasheet
www.idt.com