Fs781 b s, Marking example package drawing and dimensions, Lead (150-mil) soic s8 – Cypress FS782 User Manual
Page 10
FS781/82/84
Document #: 38-07029 Rev. *F
Page 10 of 12
Marking Example
Package Drawing and Dimensions
Cypress
FS781BS
Date Code, Lot #
Cypress
FS781BT
Date Code, Lot #
FS781 B S
Cypress Device Driver
Revision
Package
S = SOIC
T = TSSOP
SEATING PLANE
PIN 1 ID
0.230[5.842]
0.244[6.197]
0.157[3.987]
0.150[3.810]
0.189[4.800]
0.196[4.978]
0.050[1.270]
BSC
0.061[1.549]
0.068[1.727]
0.004[0.102]
0.0098[0.249]
0.0138[0.350]
0.0192[0.487]
0.016[0.406]
0.035[0.889]
0.0075[0.190]
0.0098[0.249]
1. DIMENSIONS IN INCHES[MM] MIN.
MAX.
0°~8°
0.016[0.406]
0.010[0.254]
X 45°
2. PIN 1 ID IS OPTIONAL,
ROUND ON SINGLE LEADFRAME
RECTANGULAR ON MATRIX LEADFRAME
0.004[0.102]
8 Lead (150 Mil) SOIC S08
1
4
5
8
3. REFERENCE JEDEC MS-012
PART #
S08.15 STANDARD PKG.
SZ08.15 LEAD FREE PKG.
4. PACKAGE WEIGHT 0.07gms
8-lead (150-Mil) SOIC S8
51-85066-*C