Compaq SmartModule Express SMX945 - Manual (Page 14)

DIGITAL-LOGIC AG SMX945 Condensed Manual V1.0A
14
Physical Characteristics
Specification
Dimensions Length: 117 mm +/- 0.1mm
Depth: 70 mm +/- 0.1mm
Height: 15 mm +/- 0.2mm (with 5mm bus connectors)
18 mm +/- 0.2mm (with 8mm bus connectors)
The connector height is selected by the connector on the carrier board.
Weight 120 gr / 12 ounces
PCB Thickness 1.6 mm / 0.0625 inches nominal
PCB Layer Multilayer
Operating Environment Specification
Relative Humidity 5-90% non-condensing
Vibration 5 to 2000 Hz
Shock 10 G
Operating Temperature Standard: T.B.D. (depends on the CPU and the cooling concept)
Extended Range: T.B.D.
Maximum Copper Temperature 90°C
Storage Temperature -55°C to +85°C
EMI / EMC (IEC1131-2 refer MIL
461/462) Specification
ESD Electro Static Discharge IEC 801-2, EN55101-2, VDE 0843/0847 Part 2
Metallic protection needed
Separate Ground Layer included
15 kV single peak
REF Radiated Electromagnetic Field IEC 801-3, VDE 0843 Part 3, IEC770 6.2.9.
Not tested
EFT Electric Fast Transient (Burst) IEC 801-4, EN50082-1, VDE 0843 Part 4
250V - 4kV, 50 ohms, Ts=5ns
Grade 2: 1KV Supply, 500 I/O, 5Khz
SIR Surge Immunity Requirements IEC 801-5, IEEE587, VDE 0843 Part 5
Supply:
2kV, 6 pulse/minute
I/O: 500V, 2 pulse/minute
FD, CRT: None
High-Frequency Radiation EN55022
All information is subject to change without notice.