Compaq 8100 - Manual (Page 27)

LSI PCIe x1 56K LSI PCIe x1 56K LSI PCIe x1 56K LSI PCIe x1 56K
International SoftModem
International SoftModem International SoftModem International SoftModem
Data Transmission Data Transmission Data Transmission Data Transmission Technology speeds: 56,000 Kbps maximum downstream data, controllerless
NOTE: NOTE: NOTE: NOTE: 56 Kbps technology refers to download speeds only and requires
compatible modems at server sites. Other conditions may limit modem
speed. FCC limitations allow a maximum of 53 Kbps during download
transmissions.
Data Speeds Data Speeds Data Speeds Data Speeds (Upload only) 33,600/31,200/28,800/26,400/21,600/19,200/
16,800/14,400/12,000/9,600/7,200/4,800/2,400/1,200/300
Data Standards Data Standards Data Standards Data Standards ITU-T V.90, ITU-T, ITU-T V.34, V.44, V.42, V.42bis21, V.32bis, Bell 212A,
and Bell 103
Fax Speeds Fax Speeds Fax Speeds Fax Speeds 14,400/12,000/9,600/7,200/4,800/2,400/1,200/300 b/s
Fax Mode Capabilities Fax Mode Capabilities Fax Mode Capabilities Fax Mode Capabilities ITU-T T.31 class 1 FAX, V. 17, V.29, V.27ter, and V.21 Channel 2
Error Correction and Error Correction and Error Correction and Error Correction and
Data Compression
Data Compression Data Compression Data Compression
V.44, 42bis, V.42 and MNP2-5
Power Management Power Management Power Management Power Management PCI Bus Power Management Interface Specification (PCI-PM) Revision 1.2,
Appendix A. D0, D3hot, and D3cold. Wake on Ring state when in D3cold. If
the power management event (PME) feature is enabled in D3cold, a modem
can wake the system via WAKE# (WAKEN) or beacon. Meets PCI Express
1.1 standard.
Upgradeability Upgradeability Upgradeability Upgradeability Driver upgradeable for future enhancements
Video Video Video Video ITU-T V.80 video ready interface
Other Other Other Other TIA/EIA 602 standard AT command set
Integrated DTE interface with speeds of up to 115.2 Kbps, parallel 16550a
UART-compatible interface
Optional ring wakeup signal
Operating Temperature Operating Temperature Operating Temperature Operating Temperature 32° to 158° F (0° to 70° C)
Operating Humidity Operating Humidity Operating Humidity Operating Humidity 20% to 90%, non-condensing
Power Power Power Power Requires a 3.3-V auxiliary power rail on PCI express bus
Uses only one PCI express load (i.e., one grant/request pair), one shared
IRQ, one electrical load
Chipset Chipset Chipset Chipset LSI SV92EX - Integrated PCI interface with 3.3-V tolerant buffers and
CardBus support
Dimensions Dimensions Dimensions Dimensions (L X H) Complies with PCI express low profile specifications-6.7 x 2.3 in (17.0 x 5.8
cm) and supports high- and low-profile brackets
Connection Connection Connection Connection Single RJ-11 connector
Other Features Other Features Other Features Other Features Digital line protection, call progress monitoring via on-board piezo device,
support for high profile and low profile brackets, PnP ID support
Safety Safety Safety Safety UL recognized to UL 1950, 3rd edition (U.S. and Canada); IEC 950 (TUV,
NEMKO, DEMKO, SEMKO); CE Mark, EC 950 (TUV, NEMKO, DEMKO,
SEMKO, CE mark
EMC EMC EMC EMC FCC Part 15, IC ES003, EN 55022, 3rd edition, EN 55024, annex A, EN
61000-4-6, EN 61000-4-8
Telecom Telecom Telecom Telecom FCC Part 68, IC-CS-03 (Canada); Worldwide PTT approvals
Not available in Korea or the Republic of South Africa.
QuickSpecs
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Technical Specifications - Communications
DA - 13524 Worldwide — Version 5 — February 3, 2010 Page 27