2 introduction, 1 product description, 2 naming clarification – Kontron COMe-bPC2 User Manual
Page 8: Introduction, Product description, Naming clarification
COMe-bPC2 / Introduction
2 Introduction
2.1
Product Description
The COMe-bPC2 module unifies the 45 nm generations of Intel® Core™ 2 Duo processors with the new SSE4 instruction set
and the chipset Intel® GS45, GM45 and GL40. This combination really sets new standards in many terms: more
performance than ever on COM Express® form factor, outstanding performance-power-ratio, fast DDR3 SO-DIMM memory
up to 8 GB and L2 cache up to 6 MB, the module really opens up new application fields.
COMe-bPC2 is available with Intel® small form factor package: for instance, the ICH9M was shrunk from 961 mm² to 256
mm². Thus, valuable space for further features is gained: among others two stacked SO-DIMM sockets for dual channel
memory. On top of that, Intel® small form factor package processors allow operations in ultra low voltage for best
energy-efficiency. The bigger Intel® Performance Package offer high performance for bargain pricing.
Especially, its 4 Serial ATA ports and the native RAID support establishes the COMe-bPC2 perfectly for heavy data sensitive
applications. On top of all that, DirectX® 10 supports Windows® perfectly.
Like all KontronCOM Express® modules, it is strictly compliant to the COM Express® standard. Therefore, upgrading
existing carrier boards gets so easy and minimizes redesign efforts.
2.2
Naming clarification
COM Express® defines a Computer-On-Module, or COM, with all components necessary for a bootable host computer,
packaged as a super component.
» COMe-bXX# modules are Kontron's COM Express® modules in basic form factor (125mm x 95mm), formerly known
as ETXexpress®
» COMe-cXX# modules are Kontron's COM Express® modules in compact form factor (95mm x 95mm), formerly known
as microETXexpress®
» COMe-mXX# modules are Kontron's COM Express® modules in mini form factor (55mm x 84mm), formerly known as
nanoETXexpress
The product names for Kontron COM Express® Computer-on-Modules consist of a short form of the industry standard
(
COMe-), the form factor (b=basic, c=compact, m=mini), the capital letters for the CPU and Chipset Codenames (XX) and
the pin-out type (
#) followed by the CPU Name.
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