Mag Layers USA SMB-403025 - Manual (Page 3)

(4) RELIABILITY TEST METHOD
MECHANICAL
TEST ITEM SPECIFICATION TEST DETAILS
Solder The product shall be connected to the test Apply cream solder to the printed circuit board .
ability circuit board by the fillet (the height Refer to clause 8 for Reflow profile.
is 0.2mm).
Resistance to There shall be no damage or problems. Temperature profile of reflow soldering
Soldering
heat (reflow
soldering)
The specimen shall be passed through the reflow
oven with the condition shown in the above pro-
file for 1 time.
The specimen shall be stored at standard atmosph-
eric conditions for 1 hour, after which the measu-
rement shall be made.
Terminal The terminal electrode and the ferrite must Solder a chip to test substrate , and then
strength not damaged. laterally apply a load 9.8N in the arrow direction.
Strength on The terminal electrode and the ferrite must Solder a chip to test substrate and then apply a load.
PC board not damaged.
bending
High
Impedance:Within ±20% of the initial value. After the samples shall be soldered onto the test
temperature
Insulation resistance and DC resistance on circuit board,the test shall be done.
resistance
the specification(refer to clause 2-1) Measurement : After placing for 24 hours min.
shall be met. Temperature : +85 ±2℃
not damaged. Applied current : Rated current
Testing time : 500 ±12 hours
Page 3/6 SMB-403025
M A G . L A Y E R S