Mag Layers USA MSI-280904CP - Manual (Page 3)

(4) RELIABILITY TEST METHOD
MECHANICAL
SPECIFICATION TEST DETAILS
Substrate bending △L/Lo≦ ±5% The sample shall be soldered onto the printed circuit board
in figure 1 and a load applied unitil the figure in the arrow
direction is made approximately 3mm.(keep time 30 seconds)
no mechanical PCB dimension shall the page 7/9
damage or elec- F(Pressurization)
trical damege.
Vibration △L/Lo≦ ±5% The sample shall be soldered onto the printed circuit board
and when a vibration having an amplitude of 1.52mm
There shall be and a frequency of from 10 to 55Hz/1 minute repeated should
no mechanical be applied to the 3 directions (X,Y,Z) for 2 hours each.
damage. (A total of 6 hours)
Solderability
New solder Flux (rosin, isopropyl alcohol{JIS-K-1522}) shall be coated
More than 90% over the whole of the sample before hard, the sample shall
then be preheated for about 2 minutes in a temperature of
130～150℃ and after it has been immersed to a depth 0.5mm
below for 3 ±0.2 seconds fully in molten solder M705 with
a temperature of 245 ±5℃.
More than 90% of the electrode sections shall be couered
with new solder smoothly when the sample is taken out of
the solder bath.
Page-3/8 MSI-280904CP-SERIES- □-□□
PRESSURE ROD
figure-1
MAG.LAYERS