Mag Layers USA GMLI-201209/12 - Manual (Page 7)

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RELIABILTY TEST R
MAG.LAYERS
GMLI-201209、201212 Series
R E E L L I I A A B B I I L L T T Y T Y T E E S S T T
Mechanical Performance Test
ITEM SPECIFICATION TEST CONDITION
Solderability
More than 90% of the terminal electrode shall
be covered with fresh solder. Solder:
96.5Sn-3.0Ag-0.5Cu
Solder Temperature:
245  5℃
Flux: Rosin
Dip Time: 3
 1 Seconds
Soldering Heat Resistance
The chip shall not crack.
More than 75% of the terminal electrode shall
be covered with solder.
Solder: 96.5Sn-3.0Ag-0.5Cu
Solder temperature : 260
 5℃
Flux: Rosin
Dip time: 10
 1 seconds
TYPE W(KGF) TIME (SEC)
GMLI-160808
GMLI-201209
Terminal Strength
The terminal electrode shall not be broken off
nor the ferrite damaged.
W
GMLI-201212
0.6 30  5
TYPE W(KGF) TIME (SEC)
GMLI-160808
GMLI-201209
Terminal Strength
The terminal electrode shall not be broken off
nor the ferrite damaged.
GMLI-201212
1.0 10  5
TYPE A(MM) P(KGF)
GMLI-160808
GMLI-201209
0.6 1.0 Bending Strength
No mechanical damage.
The ferrite shall not be damaged.
A
Chip
P
1.0 R0.5
GMLI-201212 1.0 1.4
Bending Test
Appearance: No damage
Substrate: PCB(100mm ×40mm×1.6mm)
Solder: Reflow
Speed of Applying Force: 0.5mm / s
Deflection: 2mm
Hold Duration: 30 s
Vibration
Impedance shall be within  20% of the initial
value.
There shall be no mechanical damage.
The sample shall be soldered onto the
printed circuit board and when a vibration
having an amplitude of 1.52mm and a
frequency of from 10 to 55Hz/1 minute
repeated should be applied to the 3 directions
(X,Y,Z) for 2 hours each.
Drop shock
No apparent damage Dropped onto printed circuit board from
100cm height three times in x, y, z directions.
The terminals shall be protected.
W