SP / Silicon Power SP008GBSTU160N02 - Manual (Page 9)

DDR3 SODIMM
Product Datasheet
Rev. 1.5a Nov. 2012 9
Environmental Requirements
Symbol Parameter Rating Units Note
T
OPR
Module Operating Temperature Range (ambient) 0 to 55 °C 3
H
OPR
Operating Humidity (relative) 10 to 90 % 1
T
STG
Storage Temperature (Plastic) -55 to 100 °C 1
H
STG
Storage Humidity (without condensation) 5 to 95 % 1
P
BAR
Barometric Pressure (operating & storage) 105 to 69 K Pascal 1, 2
Note:
1. Stresses greater than those listed may cause permanent damage to the device. This is a stress rating only and
device functional operation at or above the conditions indicated is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect reliability.
2. Up to 9850 ft.
3. The component maximum case temperature shall not exceed the value specified in the component spec.
Absolute Maximum DC Ratings
Symbol Parameter Rating Units Note
V
DD
Voltage on V
DD
pins relative to V
SS
-0.4 V ~ 1.975 V V 1, 3
V
DDQ
Voltage on V
DDQ
pins relative to V
SS
-0.4 V ~ 1.975 V V 1, 3
V
IN
, V
OUT
Voltage on I/O pins relative to V
SS
-0.4 V ~ 1.975 V V 1
T
STG
Storage Temperature -55 to +100 °C 1, 2
Note:
1. Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at these or any other conditions above
those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect reliability.
2. Storage Temperature is the case surface temperature on the center/top side of the DRAM.
3. V
DD
and V
DDQ
must be within 300 mV of each other at all times; and V
REF
must be not greater