Diodes MMSTA64 User Manual
Mmsta63/mmsta64, Features, Mechanical data
MMSTA63/MMSTA64
PNP SURFACE MOUNT DARLINGTON TRANSISTOR
Features
•
Epitaxial Planar Die Construction
•
Complementary NPN Types Available
(MMSTA13/MMSTA14)
•
Ultra-Small Surface Mount Package
•
Ideal for Medium Power Amplification and Switching
•
High Current Gain
•
Lead Free/RoHS Compliant (Note 2)
•
"Green" Device (Note 3 and 4)
Mechanical Data
DS30159 Rev. 9 - 2
1 of 3
www.diodes.com
MMSTA63/MMSTA64
© Diodes Incorporated
•
Case: SOT-323
•
Case Material: Molded Plastic, "Green" Molding
Compound, Note 4. UL Flammability Classification
Rating 94V-0
•
Moisture Sensitivity: Level 1 per J-STD-020C
•
Terminal Connections: See Diagram
•
Terminals: Solderable per MIL-STD-202, Method 208
•
Lead Free Plating (Matte Tin Finish annealed over Alloy
42 leadframe).
•
MMSTA63 Marking K2E, K3E, See Page 3
•
MMSTA64 Marking K3E, See Page 3
•
Ordering & Date Code Information: See Page 3
•
Weight: 0.006 grams (approximate)
SOT-323
Dim
Min
Max
A
0.25
0.40
B
1.15
1.35
C
2.00
2.20
D
0.65 Nominal
E
0.30
0.40
G
1.20
1.40
H
1.80
2.20
J
0.0
0.10
K
0.90
1.00
L
0.25
0.40
M
0.10
0.18
α
0
°
8
°
All Dimensions in mm
A
M
J
L
E
D
Maximum Ratings
@T
A
= 25°C unless otherwise specified
Characteristic
Symbol
Value
Unit
Collector-Base Voltage
V
CBO
-30
V
Collector-Emitter Voltage
V
CEO
-30
V
Emitter-Base Voltage
V
EBO
-10
V
Collector Current - Continuous
I
C
-500
mA
Power Dissipation (Note 1)
P
d
200
mW
Thermal Resistance, Junction to Ambient (Note 1)
R
θJA
625
°C/W
Operating and Storage Temperature Range
T
j
, T
STG
-55 to +150
°C
Notes: 1. Device mounted on FR-4 PCB, 1 inch x 0.85 inch x 0.062 inch; pad layout as shown on Diodes Inc. suggested pad layout document AP02001,
which can be found on our website at http://www.diodes.com/datasheets/ap02001.pdf.
2. No purposefully added lead.
3. Diodes Inc.'s "Green" policy can be found on our website at http://www.diodes.com/products/lead_free/index.php
4. Product manufactured with Date Code 0627 (week 27, 2006) and newer are built with Green Molding Compound. Product manufactured prior to Date
Code 0627 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.
C
E
B
B C
H
K
B
E
C
G