Absolute maximum ratings, Maximum current at v, Thermal characteristics – Diodes ZXTR2008K User Manual
Page 2: Esd ratings, Zxtr2008k, A product line of diodes incorporated

ZXTR2008K
Document number: DS36329 Rev. 2 - 2
2 of 7
December 2013
© Diodes Incorporated
ZXTR2008K
A Product Line of
Diodes Incorporated
Absolute Maximum Ratings
(Voltage relative to GND, @T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Unit
Input Voltage
V
IN
-0.3 to 100
V
Continuous Input & Output Current
I
IN,
I
OUT
550 mA
Peak Pulsed Input & Output Current
I
IM,
I
OM
2 A
Maximum Voltage applied to V
OUT
V
OUT(max)
14.5 V
Maximum Current at V
IN
= 48V
(@T
A
= +25°C, unless otherwise specified.)
Characteristic Symbol
Value
Unit
Continuous Output Current
(Note 7)
I
OUT
55 mA
Pulsed Output Current
(Note 8)
I
OM
900
mA
(Note 9)
190
Thermal Characteristics
Characteristic Symbol
Value
Unit
Power Dissipation
(Note 5)
P
D
2.3
W
(Note 6)
1.1
Thermal Resistance, Junction to Ambient
(Note 5)
R
θJA
44
°C/W
(Note 6)
90
Thermal Resistance, Junction to Lead
(Note 10)
R
θJL
8.4
Thermal Resistance, Junction to Case
(Note 10)
R
θJC
14.6
Recommended Operating Junction Temperature Range
T
J
-40 to +125
°C
Maximum Operating Junction and Storage Temperature Range
T
J,
T
STG
-65 to +150
°C
ESD Ratings
(Note 11)
Characteristics Symbols
Value
Unit
JEDEC
Class
Electrostatic Discharge – Human Body Model
ESD HBM
4000
V
3A
Electrostatic Discharge – Machine Model
ESD MM
400
V
C
Notes:
5. For a device mounted with the exposed V
IN
pad on 50mm x 50mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still
air conditions whilst operating in steady-state.
6. Same as note 5, except mounted on 15mm x 15mm 1oz copper.
7. Same as note 5, whilst operating at V
IN
= 48V. Refer to Safe Operating Area for other Input Voltages.
8. Same as note 5, except measured with a single pulse width = 100µs and V
IN
= 48V.
9. Same as note 5, except measured with a single pulse width = 10ms and V
IN
= 48V.
10.
R
θJL
= Thermal resistance from junction to solder-point (on the exposed V
IN
pad).
R
θJC
= Thermal resistance from junction to the top of case.
11. Refer to JEDEC specification JESD22-A114 and JESD22-A115
.